---
title: "Taiwan Semiconductor Manufacturing Company Limited (TSM.US) Q3 2025 Earnings Conference Call"
description: "台积电 (TSM.US) 2025 年第三季度业绩电话会"
locale: "en"
url: "https://longbridge.com/en/lives/335139"
parent: "https://longbridge.com/en/lives.md"
category: "Earnings Call"
---

# Taiwan Semiconductor Manufacturing Company Limited (TSM.US) Q3 2025 Earnings Conference Call

**Status**: Unknown
**Category**: Earnings Call

## Description

台积电 (TSM.US) 2025 年第三季度业绩电话会

## Live Recap

### 00:25 - Opening Remarks by Jeff Su

Jeff Su, Director of Investor Relations at TSMC, welcomes participants to the Q3 2025 earnings call, noting the use of English for the global audience.

### 01:18 - CFO Wendell Huang Q3 Financial Highlights

CFO Wendell Huang reports a 10.1% quarter-over-quarter revenue increase to $33.1 billion, with a gross margin rise to 59.5% due to cost improvements and higher capacity utilization.

### 06:30 - CFO Wendell Huang Q4 Guidance

CFO Wendell Huang provides Q4 guidance, expecting revenue between $32.2 billion and $33.4 billion, with a gross margin between 59% and 61%.

### 11:42 - CEO C.C. Wei Business Outlook

CEO C.C. Wei discusses strong demand for TSMC's leading process technologies, projecting nearly 30% year-over-year revenue growth in 2025.

### 22:38 - AI Demand and Capacity Expansion — Analyst: Morgan Stanley

CEO C.C. Wei addresses AI demand, noting strong customer engagement and plans to update capacity expansion details early next year.

### 30:30 - Customer Demand and Innovation — Analyst: Morgan Stanley

CEO C.C. Wei discusses system-level innovation and TSMC's collaboration with customers to meet performance requirements.

### 35:50 - Gross Margin Outlook — Analyst: UBS

CFO Wendell Huang comments on 2026 gross margin expectations, noting potential dilution from new nodes and foreign exchange impacts.

### 42:16 - AI Infrastructure Growth — Analyst: Goldman Sachs

CEO C.C. Wei discusses AI infrastructure growth, emphasizing TSMC's role in supporting customer demand with advanced technologies.

### 48:42 - Advanced Packaging and Capacity Planning — Analyst: Citi

CEO C.C. Wei outlines plans for advanced packaging in Arizona and collaboration with OSAT partners to meet customer needs.

### 53:55 - AI Data Center Capacity — Analyst: TD Cohen

CEO C.C. Wei discusses AI data center capacity, noting customer demand for 1GW capacity and TSMC's role in supporting this growth.

---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.