---
title: "Hong Kong Stock Concept Tracking | CoWoS faces severe supply gap in advanced packaging Advanced packaging equipment growth exceeds expectations (with concept stocks)"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/207350566.md"
description: "Taiwan Semiconductor is accelerating the CoWoS expansion, but facing a serious supply shortage. It is expected that the monthly production capacity will increase to 40,000 wafers in the second half of 2024, and will further increase to 58,000 wafers per month in 2025. The annual growth rate of CoWoS capacity will reach 70%, with NVIDIA accounting for nearly half of the demand. In terms of HBM, H100 will be equipped with 80GB of HBM3, while B200 will be equipped with 288GB of HBM3e. The related company ASMPT is the main supplier of Taiwan Semiconductor's CoWoS and HBM products. The CoWoS packaging, as a bottleneck in the industry chain, will continue to benefit from the increasing demand"
datetime: "2024-06-27T01:41:02.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/207350566.md)
  - [en](https://longbridge.com/en/news/207350566.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/207350566.md)
---

> Supported Languages: [简体中文](https://longbridge.com/zh-CN/news/207350566.md) | [繁體中文](https://longbridge.com/zh-HK/news/207350566.md)


# Hong Kong Stock Concept Tracking | CoWoS faces severe supply gap in advanced packaging Advanced packaging equipment growth exceeds expectations (with concept stocks)

AI server demand continues to rise, Taiwan Semiconductor accelerates CoWoS expansion.

Equipment manufacturers indicate that the current CoWoS supply gap is quite severe. Although the equipment factories have been delivering orders placed at the beginning of the year in recent months, the demand growth rate has far exceeded expectations. Taiwan Semiconductor has once again placed urgent orders with equipment factories. Based on previous estimates, the order visibility for ASE, Unimicron, and ChipMOS has extended to 2027.

It is estimated that by the second half of 2024, Taiwan Semiconductor's monthly CoWoS production capacity is expected to increase from the originally set 32,000 wafers per month to 40,000 wafers per month. By 2025, the monthly production capacity is projected to further increase to 58,000 wafers per month. With the opening of the new factory in Chiayi in 2028, the production capacity will see a significant annual increase during this period.

TrendForce indicates that for platforms like Blackwell's B100, the die size is double that of the existing H100. It is estimated that Taiwan Semiconductor (TSMC) will see a 150% annual increase in CoWoS total capacity in 2024. As CoWoS becomes mainstream in 2025, the annual growth rate of CoWoS capacity will reach 70%, with NVIDIA accounting for nearly half of the demand.

Regarding HBM, with the advancement of the NVIDIA GPU platform, the H100 will be equipped with 80GB of HBM3, and by 2025, the B200 will have 288GB of HBM3e, with a single chip capacity nearly tripling to quadrupling. According to the current expansion plans of the three major original manufacturers, HBM production volume in 2025 is also expected to double.

**Packaging equipment-related companies:**

**ASM Pacific Technology (00522):** ASMPT is a major supplier of 2.5D advanced packaging thermal compression bonding (TCB) used in Taiwan Semiconductor's CoWoS and HBM products. The future space for AI computing power remains vast, and CoWoS packaging, as a bottleneck in the industry chain, will continue to benefit from the increasing demand

### Related Stocks

- [Taiwan Semiconductor Manufacturing Company Limited (TSM.US)](https://longbridge.com/en/quote/TSM.US.md)
- [ASMPT (00522.HK)](https://longbridge.com/en/quote/00522.HK.md)

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