---
title: "Chipmore: Power management chip packaging technology is gradually advancing towards advanced packaging"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/222787981.md"
description: "Chipmore (688352) stated in a recent institutional survey that the packaging technology for power management chips is transitioning to advanced packaging to meet the higher requirements for stability, power consumption, and size from end products such as consumer electronics. Currently, traditional packaging forms are mainly used, such as DIP, BGA, QFP/PFP, and SO"
datetime: "2024-12-19T09:55:48.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/222787981.md)
  - [en](https://longbridge.com/en/news/222787981.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/222787981.md)
---

# Chipmore: Power management chip packaging technology is gradually advancing towards advanced packaging

Jin Shi Data reported on December 19th that Chipmore recently stated during an institutional research meeting that power management chips in fields such as industrial control, automotive electronics, and network communication are mainly based on traditional packaging, including DIP, BGA, QFP/PFP, and SO packaging forms. However, as downstream terminal demands continue to upgrade, especially in consumer electronics, the requirements for stability, power consumption, and chip size in power management have become higher. The packaging technology for power management chips is gradually transitioning from traditional packaging to advanced packaging, specifically including forms such as FC, WLCSPSiP, and 3D packaging

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