Sirui: The company's optical module chip base is applied in 400G, 800G, and 1.6T optical modules

Sirui released the investor relations activity record, stating that the applications of the company's products in the semiconductor field mainly have three directions: optical module chip bases, chip semiconductor equipment water cooling components, and high-strength high-conductivity copper alloy products. The optical module chip bases are used in 400G, 800G, and 1.6T optical modules; the water cooling components have been validated by downstream leading customers and are supplied in bulk; high-strength high-conductivity copper alloy products can be used in semiconductor target material supporting components. In addition, Sirui has developed key materials and components for applications in controlled nuclear fusion and large nuclear power generators. With the frequency of global aerospace missions reaching new highs, the company's liquid rocket thrust chamber inner wall products are expected to encounter more development opportunities in the commercial aerospace field, with major customers including Landspace, Jiuzhou Yunjian, and Interstellar Glory