---
title: "The third wafer fab of Taiwan Semiconductor in Arizona, USA, has recently broken ground"
description: "TSMC Chairman and CEO C.C. Wei stated in a statement that TSMC plans to introduce more advanced semiconductor capacity in the United States, with the company's third wafer fab in Arizona recently brea"
type: "news"
locale: "en"
url: "https://longbridge.com/en/news/238160611.md"
published_at: "2025-04-30T00:10:30.000Z"
---

# The third wafer fab of Taiwan Semiconductor in Arizona, USA, has recently broken ground

> TSMC Chairman and CEO C.C. Wei stated in a statement that TSMC plans to introduce more advanced semiconductor capacity in the United States, with the company's third wafer fab in Arizona recently breaking ground

TSMC Chairman and CEO C.C. Wei stated in a statement that TSMC plans to introduce more advanced semiconductor capacity in the United States, and the company's third wafer fab in Arizona has recently broken ground

### Related Stocks

- [TSM.US - Taiwan Semiconductor](https://longbridge.com/en/quote/TSM.US.md)
- [CP00062.US - Semiconductor](https://longbridge.com/en/quote/CP00062.US.md)

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> **Disclaimer**: This article is for reference only and does not constitute any investment advice.