---
title: "Several equity investment institutions have announced the successful issuance or planned issuance of science and technology innovation bonds, with some coupon rates below 2%"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/240132470.md"
description: "Multiple equity investment institutions, such as Xike Holdings and LUXIN, have announced the successful issuance or planned issuance of technology innovation bonds, with some coupon rates below 2%. As of May 8, a total of 24 institutions have registered to issue technology innovation bonds, with an expected scale of 15.5 billion yuan. This provides a new fundraising channel for equity investment institutions, and some institutions are considering advancing the issuance, comprehensively assessing the issuance costs, terms, and risk-sharing mechanisms"
datetime: "2025-05-14T09:36:33.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/240132470.md)
  - [en](https://longbridge.com/en/news/240132470.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/240132470.md)
generator: "portal-rs"
---

# Several equity investment institutions have announced the successful issuance or planned issuance of science and technology innovation bonds, with some coupon rates below 2%

According to incomplete statistics from reporters, from last week to this week, several equity investment institutions, including Xike Holdings, LUXIN, Xichuang Investment, Yizhuang Guotou, Yuanhe Holdings, and Jinhesheng, have intensively announced the successful issuance or planned issuance of technology innovation bonds, with some coupon rates exceeding 2%, while others are below 2%. According to statistics from the Dealers Association, as of May 8, 24 equity investment institutions have registered to issue technology innovation bonds, with an expected total scale of 15.5 billion yuan. Technology innovation bonds have opened up a new fundraising channel for equity investment institutions, and some institutions have told reporters that they are considering promoting the issuance of technology innovation bonds, comprehensively considering factors such as issuance costs, matching of terms and exits, and risk-sharing mechanisms

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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**