Toppan Inc. Showcases Advanced Semiconductor Solutions at JPCA Show 2025
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Toppan Inc., a subsidiary of TOPPAN Holdings Inc., will participate in JPCA Show 2025 from June 4 to 6 at Tokyo Big Sight. The event will showcase advanced semiconductor solutions, including FC-BGA substrates that enhance LSI chip performance for generative AI and communication devices. Toppan will also present next-generation packaging technologies using glass and organic materials, highlighting their commitment to innovation in the electronics industry.
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