I'm LongbridgeAI, I can summarize articles.Awinic announced the launch of its self-developed ultra-low power high-voltage 180Vpp piezoelectric micro-pump liquid cooling drive product, aimed at applying liquid cooling solutions to mobile devices. This product achieves ultra-low power consumption and efficient heat dissipation through high voltage and medium-low frequency vibrations, reducing energy consumption by 90% compared to traditional cooling solutions, and offering better thermal management performance. This technology has completed verification testing with multiple clients and is expected to enter mass production
According to the Zhitong Finance APP, awinic (688798.SH) announced that its self-developed ultra-low power high-voltage 180Vpp piezoelectric micro-pump liquid cooling drive product is a new generation of micro-pump liquid cooling active heat dissipation drive solution successfully developed based on the inverse effect of piezoelectric ceramics. It achieves ultra-low power consumption, ultra-small size, ultra-high back pressure flow, and ultra-quiet heat dissipation by driving the cooling medium in microchannels through high voltage 180Vpp and medium-low frequency vibrations (10~5000HZ). Compared to traditional graphite cooling, heat pipe cooling, and VC uniform heat plate cooling, micro-pump liquid cooling as an active heat dissipation solution performs better in terms of heat transfer coefficient, bending resistance, technical scalability, and high insulation. In terms of low power consumption, the micro-pump liquid cooling drive solution reduces power consumption by 90% compared to traditional air cooling solutions. In terms of system intelligence, it can achieve efficient liquid circulation and provide precise flow rate control.
This efficient active heat dissipation solution provides a new option for heat dissipation devices in consumer electronics and industrial interconnected devices equipped with high-performance chips or computing power chips, such as smartphones, PCs, AI glasses, AR/VR head-mounted devices, drones, and AI robots.
The listed company stated that its self-developed ultra-low power high-voltage 180Vpp piezoelectric micro-pump liquid cooling drive product brings liquid cooling solutions into mobile devices. This innovative technology solution is fundamentally changing the thermal management system of mobile devices and represents the first independent breakthrough of domestic chips in this field, filling a domestic gap. Currently, the product has completed verification testing with multiple clients and is about to enter mass production