OLYMPIC announced that the company plans to build the "Chip Innovation and Smart Carrier" project in the surrounding area of its headquarters in Heshan. The total investment for the project is expected to be approximately 1.5 billion RMB, with the main products being chip-embedded PCB products and high-end HDI circuit board products, designed with a production capacity of 660,000 square meters per year. The project is expected to commence construction in the second half of 2025 and start production in mid-2026. This investment aims to enhance the company's mass production capacity for high-end circuit boards, meet the increasing process requirements of downstream customers for PCBs, and strengthen the company's core competitiveness. The funding for the project will come from self-owned or self-raised funds and will not have a significant impact on the company's financial status and operating conditions
