---
title: "FASTPRINT: The company's FCBGA packaging substrate project investment exceeds 3.8 billion, and the number of sample orders surpasses the total for last year"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/254772873.md"
description: "FASTPRINT stated in the investor relations activity record that the overall investment scale of the company's FCBGA packaging substrate project has exceeded 3.8 billion, and it is fully prepared for mass production in terms of technical capabilities, production capacity, and product yield. The number of sample orders in the first half of 2025 has already surpassed the total for the entire year of 2024. Currently, Beijing Xingfei is planning to further expand its high-end HDI capacity aimed at the AI field to seize the industry opportunities brought by the AI explosion"
datetime: "2025-08-27T09:28:41.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/254772873.md)
  - [en](https://longbridge.com/en/news/254772873.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/254772873.md)
---

# FASTPRINT: The company's FCBGA packaging substrate project investment exceeds 3.8 billion, and the number of sample orders surpasses the total for last year

FASTPRINT stated in the investor relations activity record that the overall investment scale of the company's FCBGA packaging substrate project has exceeded 3.8 billion, and it is fully prepared for mass production in terms of technical capabilities, production capacity, and product yield. The number of sample orders in the first half of 2025 has already surpassed the total for the entire year of 2024. Currently, Beijing Xingfei is planning to further expand its high-end HDI capacity aimed at the AI field to seize the industry opportunities brought by the AI explosion

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