GOPRO: Will showcase advanced optical integrated sensor packaging products such as 2.5D and micro-optical co-packaging at the Optical Expo

On September 15th, GOPRO responded on the interactive platform that the company will showcase advanced optical integrated sensor packaging products such as 2.5D and micro-optical co-packaging at the Optical Expo. These products can be widely used in fields such as robotics, artificial intelligence, smart wearables, brain-computer interfaces, low-altitude economy, intelligent driving, and consumer electronics