---
title: "MTC: The company's optical communication chips have started wafer production and will gradually achieve independent supply in the future"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/257751394.md"
description: "MTC has formed a vertically integrated layout in the field of optical communication and plans to promote the independent supply of optical communication chips. The company's 2.5G DFB laser chip has started wafer production, with mass production expected in 2025; the epitaxial growth work for 10G and 25G DFB laser chips has begun, with a launch expected in 2026 for 50G DFB and CW DFB chips. At the same time, the company is actively researching silicon photonics and PIC technology, aiming to build solutions for 800G/1.6T ultra-high-speed interconnections"
datetime: "2025-09-17T13:36:57.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/257751394.md)
  - [en](https://longbridge.com/en/news/257751394.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/257751394.md)
---

> Supported Languages: [简体中文](https://longbridge.com/zh-CN/news/257751394.md) | [繁體中文](https://longbridge.com/zh-HK/news/257751394.md)


# MTC: The company's optical communication chips have started wafer production and will gradually achieve independent supply in the future

MTC announced that the company has formed a vertically integrated layout in the field of optical communication, covering "optical chips - optical devices - optical modules," and plans to leverage the advantages of vertical integration in the industrial chain to promote the independent supply of optical communication chips through a step-by-step approach. Currently, the company's 2.5G DFB laser chip has started wafer production, with mass production expected to be achieved by 2025; at the same time, the epitaxial growth work for 10G and 25G DFB laser chips has begun, with the launch of 50G DFB and CW DFB chips expected in 2026. In addition, the company is actively conducting research and development on silicon photonics and PIC technology, aiming to build solutions for co-packaged optical architectures to provide core support for 800G/1.6T ultra-high-speed interconnections

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