According to the latest survey by TrendForce, in response to AMD's (Advanced Micro Devices) launch of the MI450 Helios platform in 2026, NVIDIA (NVIDIA) has recently been actively requesting key component suppliers for the Vera Rubin server rack to increase product specifications, including that the Speed per Pin of HBM4 must be raised to 10Gbps. Although there are variables regarding whether the specifications can be improved, it is expected that SK hynix will maintain its position as the largest supplier during the initial mass production of HBM4.
As a key component for AI servers, HBM4's transmission speed and bandwidth are also focal points for specification enhancement. The base die is an important factor affecting HBM transmission speed. Among the three major suppliers, Samsung plans to upgrade the process node of HBM4 base die to FinFET 4nm in 2024, aiming for official mass production by the end of this year, with expected transmission speeds reaching 10Gbps. The output proportion of 10Gbps products is expected to be higher than that of competitors SK hynix and Micron.
TrendForce indicates that in addition to attempting to enhance HBM4 specifications, NVIDIA will primarily consider supply capacity. If the supply is too small, or if the new specifications excessively increase energy consumption or costs, NVIDIA may abandon the upgrade or categorize platform products to differentiate suppliers based on different component levels. Furthermore, it is not ruled out that after opening the first batch of supplier certifications, NVIDIA will provide other companies with more time to adjust for the execution of the second phase of certification, a strategy that will affect the speed of production ramp-up for the Vera Rubin platform after mass production.
Analyzing the supplier share of NVIDIA HBM4 in 2026, TrendForce believes that based on existing partnerships from 2024 to 2025, as well as technology maturity, reliability, and production capacity, SK hynix is expected to remain the largest supplier next year, while the supply proportions of Samsung and Micron will depend on the performance of subsequent product samples

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According to a survey by TrendForce, NVIDIA is asking its key component suppliers to enhance HBM4 specifications in response to AMD's MI450 Helios platform set to launch in 2026. SK Hynix is expected to maintain its position as the largest supplier during the initial mass production of HBM4. HBM4 is a critical component for AI servers, with a focus on improving transmission speed and bandwidth. NVIDIA may consider upgrading specifications based on supply volume and energy consumption, and may adjust its supplier certification strategy

- According to TrendForce's latest survey, NVIDIA is urging suppliers to enhance specifications for key components of the Vera Rubin server rack in response to AMD's upcoming MI450 Helios platform launch in 2026.  
- HBM4, crucial for AI servers, is expected to see SK hynix maintain its leading supplier status initially, while Samsung plans to upgrade its HBM4 base die process to FinFET 4nm by the end of 2024, aiming for a transmission speed of 10Gbps.  
- TrendForce predicts that NVIDIA may reconsider HBM4 upgrades based on supply capacity and energy costs, potentially affecting the production ramp-up of the Vera Rubin platform.

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Jibang Consulting: NVIDIA attempts to upgrade HBM4 specifications, expected to have SK Hynix as the largest supplier in 2026