---
title: "GOKE: Plans to develop a full range of in-vehicle AI chips with computing power ranging from low to high, targeting 2 million to 8 million units within three years"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/258553579.md"
description: "GOKE plans to launch a full range of in-vehicle AI chips with computing power ranging from low to high, totaling 2 million to 8 million units within three years. This series of chips will be applied to products such as smart cameras and dash cams. The company expects to release the next generation of in-vehicle AI chips that meet AEC-Q100 Grade 2 standards in the first half of 2025, with relevant validations currently underway"
datetime: "2025-09-23T14:31:31.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/258553579.md)
  - [en](https://longbridge.com/en/news/258553579.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/258553579.md)
---

# GOKE: Plans to develop a full range of in-vehicle AI chips with computing power ranging from low to high, targeting 2 million to 8 million units within three years

GOKE released the record of investor relations activities. The vehicle-mounted AI series chips launched by the company are mainly used in products such as front-mounted intelligent cameras, dash cameras, streaming electronic rearview mirrors, electronic side mirrors, camera monitoring systems, driver fatigue monitoring systems, cabin monitoring systems, and front-view ADAS integrated machines. The new generation of vehicle-mounted AI chips that meet AEC-Q100 Grade 2 is expected to be launched in the first half of 2025, with the chip already returned and lit up. Relevant AEC-Q100 verification is currently underway and is being actively promoted. The company will continue to develop new products, planning to form a full range of vehicle-mounted AI chips with a computing power ranging from low to high, totaling 2 million to 8 million units within three years

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