<div id="readability-page-1"><div><p>DNP announced the development of a nanoimprint lithography (NIL) template featuring a circuit line width of 10 nanometers (nm: 10-9 meter). The new template enables patterning for logic semiconductors equivalent to the 1.4nm generation and meets the miniaturization needs of cutting-edge logic semiconductors. In line with the shift to more sophisticated devices seen in recent years, demands have emerged for even greater miniaturization in cutting-edge semiconductors, leading to advances in Extreme Ultra-Violet (EUV) lithography-based production.</p><p>EUV lithography, however, requires substantial capital investment, energy consumption, and operating costs in building production lines and the exposure process. Since 2003, DNP has been developing NIL templates and has successfully accumulated extensive know-how in high-precision patterning. In this latest development, DNP has developed a NIL template with a 10nm line pattern.</p><p>It can replace a portion of the EUV lithography process, facilitating the manufacture of cutting-edge logic semic Conductors for clients that do not have EUV lithography production processing. Key Features: DNP has successfully achieved the new NIL template with a circuit line width of 10nm by leveraging Self-Aligned Double Patterning (SADP), which doubles pattern density through film deposition and etching a pattern formed by the lithography device. The technology also reduces power consumption in the exposure process of cutting-edge semiconductor manufacturing.</p><p>Driven by an energy-saving processing technology for ultra-fine semiconductors using NIL, it is now possible to reduce power consumption to approximately one-tenth of currently available exposure processes, such as Argon Fluoride (ArF) immersion and EUV.</p></div></div>

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<p>Dai Nippon Printing Co., Ltd. has developed a nanoimprint lithography template with a 10nm line pattern resolution for cutting-edge semiconductors. This template supports miniaturization needs and can replace parts of the EUV lithography process, reducing power consumption significantly. The technology leverages Self-Aligned Double Patterning, enhancing pattern density and energy efficiency in semiconductor manufacturing.</p>

Dai Nippon Printing Co., Ltd. Achieves 10nm Line Pattern Resolution on Nanoimprint Template for Cutting-Edge Semiconductors