---
title: "Broadcom Set To Dominate Custom AI Chip Market With 60% Share By 2027, Counterpoint Says"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/273876329.md"
description: "Counterpoint Research predicts that Broadcom will dominate the custom AI chip market with a 60% share by 2027, as major tech companies like Google, Amazon, Microsoft, and Apple ramp up their AI chip production. AI server compute ASIC shipments are expected to triple by 2027, driven by demand for faster AI solutions. While Broadcom leads, competition is intensifying, particularly from Google and MediaTek. The market is shifting from a Google-AWS duopoly to a more diversified landscape, with significant contributions from Meta and Microsoft. Taiwan Semiconductor Manufacturing Company remains the primary foundry for AI chip production."
datetime: "2026-01-27T17:26:45.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/273876329.md)
  - [en](https://longbridge.com/en/news/273876329.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/273876329.md)
---

# Broadcom Set To Dominate Custom AI Chip Market With 60% Share By 2027, Counterpoint Says

**Counterpoint Research** says the race to build custom AI silicon is accelerating, with hyperscalers scaling internal chips to meet surging demand.

**• Broadcom stock is showing upward movement. What’s driving AVGO shares up?**

## **Hyperscalers Ramp Custom AI Chips**

Leading cloud and AI providers, including **Alphabet Inc**.’s (NASDAQ:GOOGL) Google; **Amazon.com, Inc**.’s (NASDAQ:AMZN) Amazon Web Services; **Microsoft Corp** (NASDAQ:MSFT); **OpenAI**; **ByteDance** and **Apple Inc** (NASDAQ:AAPL), are rapidly expanding deployments of AI server compute Application-Specific Integrated Circuit (ASIC) based systems to handle specialized training and inference workloads, as per Counterpoint Research.

Counterpoint Research projects that AI server compute ASIC shipments among the top 10 hyperscalers will triple between 2024 and 2027, fueled by surging demand for Google's Tensor Processing Unit (TPU) infrastructure supporting Gemini, continued scaling of AWS Trainium clusters, and volume ramps from **Meta Platforms Inc.'s** (NASDAQ:META) MTIA and Microsoft's Maia chips as they build out internal silicon portfolios.

## **Broadcom Leads, Competition Intensifies**

Counterpoint expects **Broadcom Inc** (NASDAQ:AVGO) to remain the top AI server compute ASIC design partner, holding about 60% market share in 2027, despite competition from the growing Google–MediaTek alliance.

At the same time, the firm sees **Marvell Technology Inc** (NASDAQ:MRVL) facing design-win pressure, with its design services share projected to slip to around 8% in 2027, despite shipments doubling over the same period.

## **Google TPUs Anchor a Shifting Market**

Google's TPU fleet will continue to anchor industry volumes, according to Counterpoint, as the compute demands of training and serving next-generation Gemini models drive sustained internal silicon investment.

While Google's market share may ease as the total addressable market expands and rivals scale their own chips, TPUs will remain the core backbone of AI server compute ASIC deployments, as per Counterpoint.

The market itself is shifting structurally.

The AI server compute ASIC shipments are pivoting from a concentrated duopoly led by Google and AWS in 2024 toward a more diversified landscape by 2027, stated Counterpoint.

The firm highlighted meaningful contributions from Meta and Microsoft as they accelerate internal chip programs.

This reflects a broader hyperscaler strategy to reduce reliance on merchant GPUs and optimize performance per watt using custom silicon tailored to specific workloads.

For manufacturing, Counterpoint says **Taiwan Semiconductor Manufacturing Company Ltd** (NYSE:TSM) continues to dominate as the foundry of choice, accounting for nearly all wafer fabrication for the top 10 players' AI server compute ASICs, across both front-end and most back-end production.

_Photo: Shutterstock_

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