---
title: "Taiwan Semiconductor fully raises CoWoS capacity targets for 2026-2027"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/274066880.md"
description: "Taiwan Semiconductor plans to fully enhance CoWoS capacity from 2026 to 2027 in response to the demands of customers such as NVIDIA and Google. The company will add a new P2 plant in the Southern Taiwan Science Park and adjust the production focus at the Chiayi AP7 plant from WMCM, SoIC, and CoPoS to CoWoS"
datetime: "2026-01-29T00:59:30.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/274066880.md)
  - [en](https://longbridge.com/en/news/274066880.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/274066880.md)
---

# Taiwan Semiconductor fully raises CoWoS capacity targets for 2026-2027

Taiwan Semiconductor Manufacturing Company (TSMC) will fully increase its CoWoS capacity in the next two years. In addition to NVIDIA becoming its largest customer, ASIC chip clients such as Google are also frequently placing urgent orders to secure capacity. TSMC has recently decided to raise its CoWoS capacity targets for 2026-2027 and is re-evaluating its original advanced packaging expansion plans. According to supply chain sources, TSMC's Nanke AP8 plant will add a new P2 plant, with both plants focusing on CoWoS, while the original Chiayi AP7, which was primarily focused on WMCM, SoIC, and CoPoS, will switch SoIC to CoWoS. (Taiwan Electronic Times)

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