--- title: "Jensen Huang predicts \"unprecedented\" new chip products, the next-generation Feynman architecture may become the focus" description: "Jensen Huang previewed the release of a \"world's first\" new chip product at this year's GTC conference. Analysts believe the new product may involve derivatives of the Rubin series or a more revolutio" type: "news" locale: "en" url: "https://longbridge.com/en/news/276310964.md" published_at: "2026-02-19T07:32:33.000Z" --- # Jensen Huang predicts "unprecedented" new chip products, the next-generation Feynman architecture may become the focus > Jensen Huang previewed the release of a "world's first" new chip product at this year's GTC conference. Analysts believe the new product may involve derivatives of the Rubin series or a more revolutionary Feynman architecture chip. The market expects the Feynman architecture to be deeply optimized for reasoning scenarios NVIDIA CEO Jensen Huang revealed in an interview with media outlet wccftech that the company will launch a "completely new chip product that the world has never seen" at this year's GTC conference. This statement has sparked significant market interest in NVIDIA's next-generation product roadmap, with analysts suggesting that the new products may involve derivatives of the Rubin series or more revolutionary Feynman architecture chips. Jensen Huang stated: > "We have prepared several completely new chips that the world has never seen. This is no easy task, as all technologies are approaching physical limits." Considering that NVIDIA just showcased the fully production-ready Vera Rubin AI series products at CES 2026, including six new designed chips, the market expects that this GTC may introduce more cutting-edge technological solutions. For investors closely monitoring the AI infrastructure race, this means NVIDIA may once again set new industry technology standards. The NVIDIA GTC keynote speech will be held on March 15 in San Jose, California, where the next phase of the AI infrastructure race will become a core topic. ## New Products Point to Two Major Directions According to Wccftech, although Jensen Huang did not specify the details of the products, market analysis points to two main directions based on the description of "never seen before." **The first possibility is derivative chips from the Rubin series, such as the previously exposed Rubin CPX.** NVIDIA recently launched the Vera Rubin AI series at CES 2026, which includes six chips, including the Vera CPU and Rubin GPU, that have entered full production. **The second possibility is more disruptive—NVIDIA may unveil the next-generation Feynman architecture chip ahead of schedule.** It is understood that Feynman is regarded as a "revolutionary" product in the industry, potentially adopting a more extensive SRAM integration scheme and even integrating LPU (Language Processing Unit) through 3D stacking technology, although this technological route has not been officially confirmed. ## Shifting Computing Demands Drive Product Evolution NVIDIA currently faces a market environment where computing demands change seasonally. Jensen Huang's statement reflects the company's clear judgment on the direction of technological evolution. During the Hopper and Blackwell eras, pre-training was the primary demand; however, with the launch of Grace Blackwell Ultra and Vera Rubin, inference capability has become core, with latency and memory bandwidth becoming major bottlenecks. This shift in demand directly influences NVIDIA's product design direction. For the Feynman architecture, **the market expects it to be deeply optimized for inference scenarios.** NVIDIA is exploring breakthroughs in existing performance bottlenecks through larger-scale SRAM integration and possible LPU integration, which will have a significant impact on cloud service providers and enterprise customers that rely on AI inference capabilities. Additionally, Jensen Huang emphasized the importance of broader partnerships and investment strategies in the interview. He stated, "NVIDIA has excellent partners and outstanding startups, and we are investing across the entire AI stack. AI is not just a model; it is a complete industry encompassing energy, semiconductors, data centers, cloud, and applications built on top of it." This statement shows that NVIDIA is transforming from a pure chip supplier to an AI ecosystem builder. Through acquisitions and partnerships, the company is trying to maintain its leading position in the AI infrastructure race ### Related Stocks - [NVDA.US - NVIDIA](https://longbridge.com/en/quote/NVDA.US.md) - [NVDY.US - YieldMax NVDA Option Income Strategy ETF](https://longbridge.com/en/quote/NVDY.US.md) - [SMH.US - VanEck Semiconductor ETF](https://longbridge.com/en/quote/SMH.US.md) - [NVDX.US - T-Rex 2X Long NVIDIA Daily Target ETF](https://longbridge.com/en/quote/NVDX.US.md) - [NVDL.US - GraniteShares 2x Long NVDA Daily ETF](https://longbridge.com/en/quote/NVDL.US.md) - [PSI.US - Invesco Semiconductors ETF](https://longbridge.com/en/quote/PSI.US.md) - [NVDU.US - Direxion Daily NVDA Bull 2X Shares](https://longbridge.com/en/quote/NVDU.US.md) - [SOXX.US - iShares Semiconductor ETF](https://longbridge.com/en/quote/SOXX.US.md) - [XSD.US - SPDR S&P Semicon](https://longbridge.com/en/quote/XSD.US.md) - [SOXL.US - Direxion Semicon Bull 3X](https://longbridge.com/en/quote/SOXL.US.md) ## Related News & Research | Title | Description | URL | |-------|-------------|-----| | 黃仁勳稱將發佈「令世界驚訝」新晶片「所有技術都已經逼近極限」 | 英偉達執行長黃仁勳在接受《韓國經濟日報》採訪時透露,將於 2026 年 3 月 16 日在聖何塞的 GTC 大會上發布一款「令世界驚訝」的新晶片。他表示,所有技術都已逼近極限,但有信心通過團隊合作克服挑戰。新晶片可能基於 Rubin 架構或 | [Link](https://longbridge.com/en/news/276297645.md) | | OpenAI 新一輪融資或突破千億美元 據報亞馬遜、軟銀、英偉達及微軟參與投資 | OpenAI 即將完成新一輪融資,預計籌集超過 1000 億美元,估值可能超過 8500 億美元。主要投資者包括亞馬遜、軟銀、英偉達和微軟。融資將分階段進行,預計在本年度內完成。亞馬遜可能投資高達 500 億美元,軟銀 300 億美元,英偉 | [Link](https://longbridge.com/en/news/276297991.md) | | Meta 擬部署「數百萬夥」Nvidia 晶片 進一步加強合作關係 | Meta 計劃在未來幾年內部署數百萬顆 Nvidia 的 Blackwell 與 Rubin GPU,進一步加強與 Nvidia 的合作關係。此舉將使 Meta 更多地使用 Nvidia 的 AI 處理器和網絡設備,預計將為 Nvidia | [Link](https://longbridge.com/en/news/276193053.md) | | AI 金礦熱潮使得三星能夠對 HBM4 芯片收取溢價 | 三星電子正在提高其下一代高帶寬內存 4(HBM4)人工智能內存芯片的價格,尋求每個單位約 700 美元,比上一代產品上漲 20%-30%。這一價格上漲反映了三星在人工智能內存市場重新獲得的議價能力,可能會提升半導體利潤,但也會增加智能手機的 | [Link](https://longbridge.com/en/news/276325186.md) | | 拉森和圖博與英偉達合作,建設印度最大的千兆瓦級 AI 工廠 | 拉森與圖博(Larsen and Toubro)與英偉達(Nvidia)合作建設印度最大的千兆瓦級人工智能工廠 | [Link](https://longbridge.com/en/news/276207411.md) | --- > **Disclaimer**: This article is for reference only and does not constitute any investment advice.