---
title: "02:48 ETLinktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/279380308.md"
description: "Linktel Technologies has announced the debut of its 12.8T XPO liquid-cooled optical module at OFC 2026. This module is designed to meet the increasing density and thermal demands of next-generation data centers, achieving a front-panel density of 204.8 Tbps per rack unit. It features advanced thermal management and is compatible with various standards. Linktel aims to lead the development of new standards for AI workloads, showcasing its commitment to high-performance optical solutions. The demonstration will take place at Booth #1219 during the event."
datetime: "2026-03-17T06:48:57.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/279380308.md)
  - [en](https://longbridge.com/en/news/279380308.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/279380308.md)
---

# 02:48 ETLinktel, Founding Member of XPO MSA, to Debut 12.8T Liquid-Cooled Module at OFC 2026

, /PRNewswire/ -- Linktel Technologies, a globally recognized company in optical transceiver development and manufacturing, today announced its 12.8T XPO liquid-cooled optical module will be featured in live demonstrations at OFC 2026. Designed for the escalating density and thermal demands of next-generation data centers, the 64-channel XPO module supports scale-up, scale-out, scale-across, and metro-reach configurations with high efficiency for AI clusters.

The XPO form factor achieves a front-panel density of 204.8 Tbps per rack unit—a fourfold increase over current 1.6T OSFP implementations. This breakthrough enables a 75% reduction in switch footprint, optimizing space and power utilization as AI clusters scale to massive GPU counts.

**Technical Specifications & Key Innovations:  
****Universal Interconnect:** Native compatibility with DR, FR, LR, SR, and ZR/ZR+ standards across LPO, LRO, FRT, DSP architectures.  
**Advanced Thermal Management:** Features an integrated cold plate in a "belly-to-belly" configuration, reducing internal temperatures by 20°C to 25°C and supporting stable operation up to 400W.  
**Time to Market:** Utilizing existing photonics and silicon chips to ensure production readiness without requiring new specialized chips.

"The evolution of AI workloads requires a fundamental shift in bandwidth and thermal density," said Richard Xiao, VP of Product Marketing at Linktel Technologies. "As a founding member of the XPO MSA, Linktel is proud to lead the definition of these new standards. The 12.8T XPO series shows Linktel's commitment to delivering flexible, high-performance, and reliable optical solutions for next-generation AI architectures."

**OFC 2026 Demonstration  
**At Booth #1219, Linktel will demonstrate the 12.8T Liquid-Cooled XPO along with 200G/lane 1.6T modules, 400G/lane Optical Engines, and Lightwave Innovation Award-winning Dispersion Management modules.

**About Linktel Technologies  
**Linktel Technologies, with international operation centers and customer service offices in USA, Singapore, Malaysia, and China, provides high-quality products for high-speed optical I/O connectivity including high speed pluggable transceivers, optical engines, and ODM/JDM services.

For more information, visit www.linktel.com.

SOURCE Linktel Technologies

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