---
title: "Micron officially announces mass production of HBM4, binding with NVIDIA's Veo Rubin platform to seize the opportunity"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/279531027.md"
description: "Micron Technology announced the mass production of high-performance HBM4 memory at NVIDIA's GTC 2026 conference, becoming a key supplier for NVIDIA's Vera Rubin AI platform. Micron's 36GB 12-Hi HBM4 memory has a bandwidth exceeding 2.8 TB/s, with a 20% improvement in energy efficiency. The company's HBM capacity for 2026 is nearly sold out, with orders locked in through long-term agreements, marking a transformation in the HBM market. Micron has also begun delivering 48GB 16-Hi HBM4 samples and is advancing HBM4E research and development, showcasing its important position in the computing power supply chain"
datetime: "2026-03-18T04:10:04.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/279531027.md)
  - [en](https://longbridge.com/en/news/279531027.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/279531027.md)
---

# Micron officially announces mass production of HBM4, binding with NVIDIA's Veo Rubin platform to seize the opportunity

According to the Zhitong Finance APP, against the backdrop of a continuous surge in AI computing power demand, the NVIDIA GTC 2026 conference has once again become a barometer for the global semiconductor industry. The statements made by storage giant Micron Technology (MU.US) at this event undoubtedly inject new variables into the competition in the high-performance storage market. Micron not only officially confirmed at the conference that it will mass-produce high-performance HBM4 memory for NVIDIA's next-generation Vera Rubin AI platform but also showcased its indispensable ecological position in the computing power supply chain through the centralized implementation of its full-stack storage solutions.

The 36GB 12-Hi HBM4 memory that Micron is mass-producing not only achieves an astonishing bandwidth of over 2.8 TB/s but also improves energy efficiency by more than 20% compared to previous generations, which is crucial for addressing the "power wall" issue in large-scale model training. Notably, Micron's management clearly stated on-site that the company's HBM capacity for the entire year of 2026 is basically sold out, and the vast majority of orders have been signed with legally binding long-term procurement agreements.

This highly locked-in order situation marks a complete transformation of the HBM market from traditional cyclical spot trading to a deeply bound model based on customized technological collaboration. As the only major HBM supplier in the U.S., Micron's strategic premium is being accelerated.

To maintain its lead in technological generation, Micron has not stopped at the mass production of 12-layer stacking. The company announced that it has begun delivering more disruptive 48GB 16-Hi HBM4 samples to core customers, with a single chip capacity increased by 33% compared to the current mass-produced version, aimed at providing stronger memory redundancy for the subsequent upgraded version of the Vera Rubin platform. Meanwhile, Micron is vigorously advancing the research and development of the next-generation HBM4E, which is expected to enter the sampling phase in the second half of 2026.

In addition to its continued efforts in the memory field, Micron's system-level storage collaboration capabilities showcased during GTC are also noteworthy. The industry's first PCIe 6.0 data center SSD (Micron 9650) has entered mass production, setting an industry record with a sequential read speed of 28 GB/s. Coupled with the 192GB SOCAMM2 memory module designed specifically for Vera CPU, Micron is building a complete storage closed loop covering GPU memory, system memory, and high-speed cache.

This full-stack supply capability not only optimizes the overall operational efficiency of ultra-large-scale systems like NVIDIA's NVL72 but also enhances the inference response speed of Agentic AI, giving Micron a broader voice in the high-performance computing market.

From the perspective of industry competition, Micron's high-profile announcement of mass production carries significant strategic importance. Earlier in 2026, there were widespread rumors in the market that Micron was lagging behind SK Hynix and Samsung in HBM4 development progress, with reports suggesting that its market share would be divided among major competitors. However, Micron's actual mass production shipments have strongly countered these doubts, proving that it has returned to the forefront of the industry in advanced processes and packaging technology Analysts point out that as HBM4 contributes substantial revenue in fiscal year 2026, Micron's gross margin and profitability are expected to further recover. Currently, the competition among the three major global memory giants in the HBM4 sector has entered a heated stage, and Micron has taken the lead by achieving breakthroughs on NVIDIA's Vera Rubin platform, gaining an advantage in future market share competition.

"The next era of artificial intelligence will be defined by deeply integrated platforms developed through collaborative engineering innovation across the entire ecosystem," emphasized Sumit Sadana, Executive Vice President and Chief Business Officer of Micron Technology. "Our close collaboration with NVIDIA ensures that computing and memory are designed to scale in synergy from the outset."

He further added, "With the mass production of HBM4 36GB 12H, the industry's first SOCAMM2, and Gen6 SSDs, Micron is building the core infrastructure to unleash the full potential of the next generation of artificial intelligence."

As of Tuesday's close, Micron Technology's stock price rose by 4.5%, continuing its upward trend in after-hours trading, increasing by another 2.21%, and ultimately closing at $471.97

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