--- title: "Understanding the Market | SICC rose nearly 10% during trading, TSMC optimistic about large-size CoWoS SIC expected to welcome industry expansion" type: "News" locale: "en" url: "https://longbridge.com/en/news/283077468.md" description: "SICC's stock price rose nearly 10% during the session, and as of the time of writing, it is up 8.19%, trading at HKD 62.75, with a transaction volume of HKD 146 million. Taiwan Semiconductor's Q1 revenue surged 45.2% year-on-year and plans to develop larger-sized CoWoS technology. It is expected that by 2030, the silicon carbide substrate market size will grow to 66.4 billion yuan" datetime: "2026-04-17T02:02:14.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/283077468.md) - [en](https://longbridge.com/en/news/283077468.md) - [zh-HK](https://longbridge.com/zh-HK/news/283077468.md) --- # Understanding the Market | SICC rose nearly 10% during trading, TSMC optimistic about large-size CoWoS SIC expected to welcome industry expansion According to Zhitong Finance APP, TianYue Advanced (02631) rose nearly 10% during the trading session, and as of the time of writing, it is up 8.19%, priced at HKD 62.75, with a transaction volume of HKD 146 million. In terms of news, TSMC's Q1 revenue surged 45.2% year-on-year, setting a new historical record. Additionally, it was reported that on April 16, TSMC clearly stated at its earnings call that advanced packaging capacity is very tight, and its core strategy is to develop larger-sized CoWoS technology. Guotai Junan Securities previously pointed out that TSMC plans to launch 5.5 times the mask size CoWoS in 2026 and achieve 9.5 times in 2027, supporting 12-layer HBM and multi-chip integration, making advanced packaging a key variable for AI computing power. The ultra-large size brings new bottlenecks in thermal management and warpage control, and SiC materials, with their high thermal conductivity and low CTE characteristics, are expected to be gradually introduced as thermal diffusion layers and structural support layers to solve the thermal-mechanical coupling problem. Public information shows that by 2025, TianYue Advanced's conductive silicon carbide substrate market share reached 27.6%, surpassing Wolfspeed to become the global leader. Among them, the company's 8-inch silicon carbide substrate market share is leading with a remarkable 51.3% market share. Galaxy Securities believes that driven by the continuous extension of emerging application scenarios and the accelerated penetration of traditional application scenarios, the market size of silicon carbide substrates is expected to grow to RMB 66.4 billion by 2030 ### Related Stocks - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [02631.HK](https://longbridge.com/en/quote/02631.HK.md) - [688234.CN](https://longbridge.com/en/quote/688234.CN.md) - [159546.CN](https://longbridge.com/en/quote/159546.CN.md) - [588170.CN](https://longbridge.com/en/quote/588170.CN.md) - [FTXL.US](https://longbridge.com/en/quote/FTXL.US.md) - [XSD.US](https://longbridge.com/en/quote/XSD.US.md) - [TSMU.US](https://longbridge.com/en/quote/TSMU.US.md) - [562590.CN](https://longbridge.com/en/quote/562590.CN.md) - [SOXX.US](https://longbridge.com/en/quote/SOXX.US.md) - [TSMX.US](https://longbridge.com/en/quote/TSMX.US.md) - [TSMG.US](https://longbridge.com/en/quote/TSMG.US.md) - [560780.CN](https://longbridge.com/en/quote/560780.CN.md) - [159516.CN](https://longbridge.com/en/quote/159516.CN.md) - [PSI.US](https://longbridge.com/en/quote/PSI.US.md) - [SMH.US](https://longbridge.com/en/quote/SMH.US.md) - [WOLF.US](https://longbridge.com/en/quote/WOLF.US.md) - [600109.CN](https://longbridge.com/en/quote/600109.CN.md) - [601881.CN](https://longbridge.com/en/quote/601881.CN.md) - [06881.HK](https://longbridge.com/en/quote/06881.HK.md) ## Related News & Research - [TSMC Files Annual Report on Form 20-F for 2025 | TSM Stock News](https://longbridge.com/en/news/282987427.md) - [TSMC's margins set to expand next year as it exerts pricing power: Analyst](https://longbridge.com/en/news/283097799.md) - [TSMC: Strategy To Continue To Optimise Our Capacity](https://longbridge.com/en/news/282948818.md) - [TSMC in charts: 3nm chips drive 25% of wafer revenue in Q1, with advanced nodes (7nm and below) at 74%](https://longbridge.com/en/news/282951178.md) - [PREVIEW-TSMC likely to book fourth straight quarter of record profit on insatiable AI demand](https://longbridge.com/en/news/282478726.md)