--- title: "HuaYuan Securities: Google releases the eighth generation TPU with breakthroughs in both performance and energy efficiency" type: "News" locale: "en" url: "https://longbridge.com/en/news/284488858.md" description: "Huayuan Securities released a research report stating that Google has launched the eighth generation TPU, which includes TPU 8t and TPU 8i, achieving breakthroughs in both performance and energy efficiency. The training cost-effectiveness of TPU 8t has improved by 2.7 times, while the inference cost-effectiveness of TPU 8i has increased by 80%. The new chip uses fourth-generation liquid cooling technology, doubling performance per watt, and integrates diamond substrate cooling technology to further enhance cooling efficiency. Google has optimized the efficiency of the entire stack, with computing power per unit of electricity consumption in data centers increasing sixfold compared to five years ago" datetime: "2026-04-29T03:54:04.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/284488858.md) - [en](https://longbridge.com/en/news/284488858.md) - [zh-HK](https://longbridge.com/zh-HK/news/284488858.md) --- # HuaYuan Securities: Google releases the eighth generation TPU with breakthroughs in both performance and energy efficiency According to the Zhitong Finance APP, Huayuan Securities released a research report stating that Google (GOOGL.US) has launched the eighth generation TPU, which includes the TPU 8t specialized for training and the TPU 8i for inference. Compared to the previous generation, the training cost-performance ratio has improved by 2.7 times, and the inference cost-performance ratio has improved by 80%. The new chip adopts fourth-generation liquid cooling technology, doubling performance per watt. Additionally, it integrates diamond substrate cooling technology, which is expected to further enhance cooling efficiency. ## The main points from Huayuan Securities are as follows: **The performance of Google's eighth generation TPU has significantly improved compared to the seventh generation Ironwood** On April 22, 2026, Google officially launched the eighth generation TPU at the Cloud Next conference, including TPU 8t and TPU 8i. TPU 8t excels at handling large-scale, compute-intensive training workloads, providing greater computational throughput and stronger scalable bandwidth. TPU 8i, on the other hand, has higher memory bandwidth and is designed for latency-sensitive inference workloads. In terms of training cost-performance ratio, TPU 8t improves by 2.7 times compared to Ironwood TPU, making it suitable for large-scale training. For inference cost-performance ratio, TPU 8i improves by 80% compared to Ironwood TPU, especially in achieving low-latency targets for large MoE models. **The eighth generation TPU continues to optimize efficiency, adopting fourth-generation liquid cooling design, enhancing energy efficiency** The performance per watt of Google's two chips has increased to double. To address power consumption issues, Google has optimized the efficiency of the entire stack and integrated power management functions that can dynamically adjust power consumption based on real-time demand. In addition to efficiency optimizations at the chip level, Google has also made improvements to the system-level architecture from chip to data center. For example, it has integrated network connectivity and computing on the same chip, significantly reducing the energy consumption of data transfer between TPU chips. With continuous innovations in hardware and software, the computational power of Google's data centers per unit of power consumption has increased sixfold compared to five years ago. Furthermore, TPU 8t and TPU 8i utilize fourth-generation liquid cooling technology, achieving performance densities that air cooling cannot. **The integration of diamond as a substrate material is expected to further enhance cooling effects** Diamond Foundry has released a latest technical report, stating that the thermal conductivity of single-crystal diamond is 16 times that of silicon and about six times that of materials such as silicon carbide, copper, AlN, silver, and gold. Diamond not only serves as a thermal conduction medium but also, when integrated as a substrate in high-power chip packaging, provides excellent cooling effects. It can achieve two-phase cooling at the chip level by redistributing overall thermal resistance and the temperature drop across the substrate. This design can enhance cooling performance by 10 to 100 times. **Investment Recommendations** The penetration rate of liquid cooling is continuously increasing, with diverse technologies in parallel. The firm recommends paying attention to liquid cooling companies under relevant technologies: 1) Full systems: Invec, Shenling Environment, etc. 2) Cold plates: Yidong Electronics, Kexin New Source, Siquan New Materials, ShuoBeide, Hongfuhan, Tongfei Co., Ltd., JieBang Technology, Far East Co., Ltd., etc. 3) CDU and other components: Xingrui Technology, Gaolan Co., Ltd., Feilong Co., Ltd., Chuanhuan Technology, Chuanrun Co., Ltd., Yimikang, Zhongshi Technology, Shuguang Digital Innovation, Dayuan Pump Industry, etc. 4) Coolants: Runhe Materials, Yongtai Technology, Juhua Co., Ltd., Dongyangguang, Xinzhoubang, etc 5) TIM: Feirongda, Debang Technology, etc. 6) Diamond Heat Dissipation: Sifangda, World, Huanghe Xuanfeng, Power Diamond, Guoji Jinggong, Huifeng Diamond, etc. **Risk Warning** 1. Technology progress is not as expected. 2. Overseas capital expenditure is not as expected. 3. 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