---
title: "Shanghai Fudan Microelectronics partners Fudan University to build integrated circuit innovation center"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/285953590.md"
description: "Shanghai Fudan Microelectronics has partnered with Fudan University to establish an integrated circuit innovation center, supported by Shanghai Guosheng Group Investment. A RMB 20 million start-up fee will be allocated for talent hiring and R&D. The company plans to invest up to RMB 1 billion over 60 months, with joint IP ownership and exclusive commercialization rights. The agreement is subject to Shanghai and Hong Kong listing approvals and will be presented to shareholders."
datetime: "2026-05-11T13:36:05.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/285953590.md)
  - [en](https://longbridge.com/en/news/285953590.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/285953590.md)
---

# Shanghai Fudan Microelectronics partners Fudan University to build integrated circuit innovation center

-   Shanghai Fudan Microelectronics on May 11, 2026 signed cooperation agreement with Fudan University, supported by Shanghai Guosheng Group Investment, to jointly build integrated-circuit engineering technology innovation center focused on frontier R&D. \* RMB 20 million start-up fee to be paid within 30 days of agreement taking effect, earmarked for talent hiring, R&D platform buildout, facilities costs. \* Company expects to provide up to RMB 1 billion in total funding over 60 months, with project-specific technical development agreements to set budgets, milestones, deliverables. \* Jointly generated IP will be co-owned, with exclusive industrialization and commercialization rights granted to company and its controlled affiliates. \* Agreement requires completion of required Shanghai, Hong Kong listing-rule approvals, with proposal to be put to shareholders. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Shanghai Fudan Microelectronics Group Co. Ltd. published the original content used to generate this news brief via IIS, the Issuer Information Service operated by the Hong Kong Stock Exchange (HKex) (Ref. ID: HKEX-EPS-20260511-12155416), on May 11, 2026, and is solely responsible for the information contained therein. © Copyright 2026 - Public Technologies (PUBT)

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