--- title: "Taiwan Semiconductor accelerates new generation materials and equipment, NRB CORPORATION and JingDing rise to the first tier" type: "News" locale: "en" url: "https://longbridge.com/en/news/286126460.md" description: "Taiwan Semiconductor is collaborating with American company Applied Materials to develop next-generation semiconductor materials and equipment, aiming to accelerate AI scalability. NRB CORPORATION and JINGDING have become major partners for Taiwan Semiconductor's next-generation processes due to their deep expertise in key technologies. NRB CORPORATION has performed outstandingly in the semiconductor materials supply chain, breaking the monopoly of Japanese companies by providing critical target materials. JINGDING is expected to benefit from the demand in the semiconductor market, with the equipment market projected to grow by 7% to 9% by 2026" datetime: "2026-05-12T15:30:48.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/286126460.md) - [en](https://longbridge.com/en/news/286126460.md) - [zh-HK](https://longbridge.com/zh-HK/news/286126460.md) --- # Taiwan Semiconductor accelerates new generation materials and equipment, NRB CORPORATION and JingDing rise to the first tier Taiwan Semiconductor Manufacturing Company (TSMC) （2330） enhances its capabilities by launching a new collaboration with Applied Materials, the global leader in semiconductor equipment, to jointly develop materials, equipment, and process technologies for the next generation of semiconductor components, aiming to accelerate AI scaling. Industry insiders point out that the latest collaboration between TSMC and Applied Materials highlights the core role of semiconductor materials and equipment in next-generation processes. Taiwan's supply chain partners, NRB CORPORATION （1785） and JINGDING （3413）, have become key players supporting TSMC's next-generation processes due to their deep expertise in critical technologies. In recent years, NRB CORPORATION has demonstrated strong transformation capabilities, having moved beyond its traditional business of precious metal trading to become a key supplier in the global semiconductor materials supply chain. It has also broken the long-standing monopoly of Japanese companies by supplying TSMC with critical target materials for advanced processes, assisting the "sacred mountain of the nation" in creating smaller, more powerful, and more efficient chips. Analysts note that the importance of target materials in next-generation processes is increasingly evident, primarily because as chips enter advanced logic nodes, the transistor structure and interconnect architecture become extremely complex. Without high-purity, high-performance new materials, it is challenging to achieve the goals of increasing power, performance, and reducing area. The key target materials developed by NRB CORPORATION for advanced processes can help TSMC accurately form 3D transistor structures, ensuring yield and reliability under highly miniaturized architectures. Analysts expect that as the proportion of advanced process products continues to rise, NRB CORPORATION's high-margin service revenue will also optimize its profitability. On the equipment side, long-term partner JINGDING benefits from semiconductor market demand, with order visibility significantly extended. JINGDING indicates that the active expansion of wafer fabs is driving an increase in front-end equipment spending (WFE), with research data estimating that the WFE market will grow by 7% to 9% by 2026, primarily driven by upgrades in advanced processes such as GAA structures and HBM high-bandwidth memory, as well as the expansion of advanced packaging. As equipment installation schedules concentrate in the second half of the year, JINGDING's operational momentum is expected to strengthen significantly in the second half of 2026 and further amplify in 2027, with the recovery in memory applications continuing to contribute to equipment opportunities. The company emphasizes that it currently has a complete global layout, with multiple locations in Taiwan, Thailand, mainland China, and the United States, providing high supply flexibility and adaptability to respond to tariff challenges arising from changes in the global trade environment. JINGDING is also actively exploring emerging business areas such as drones and flying vehicles, coupled with growth momentum in overseas markets, showcasing a diversified industrial layout outlook. Overall, as Applied Materials and TSMC evolve their capabilities, the Taiwan supply chain will continue to play a key supporting role in the wave of AI scaling from both the materials and equipment sides Applied Materials has been an important partner of Taiwan Semiconductor for many years. On the 12th, they announced the launch of their latest collaboration, which will take place at Applied Materials' new Equipment and Process Innovation and Commercialization Center (EPIC) located in Silicon Valley, USA. This initiative aims to enhance innovative capabilities and accelerate the transition of breakthrough technologies from research and development to mass production. Applied Materials mentioned that the key areas of focus in their latest collaboration with Taiwan Semiconductor include: 1. Continuously improving process technologies for power, performance, and area efficiency at advanced logic nodes to meet the growing demand for AI and high-performance computing; 2. New materials and next-generation manufacturing equipment to precisely shape increasingly complex 3D transistors and interconnect structures. 1. Advanced process integration methods to enhance yield, variation control, and reliability as components move towards vertical stacking and highly miniaturized architectures. Industry experts explain that the collaboration between Taiwan Semiconductor and Applied Materials in promoting materials engineering, equipment innovation, and process integration technology development will break the traditional model of "equipment and material suppliers developing equipment, and wafer fabs (clients) adopting it." This allows for participation in relevant research and development during the early stages of wafer fab (client) development, gaining insights ahead of time. Gary Dickerson, President and CEO of Applied Materials, stated that the deep collaboration between Applied Materials and Taiwan Semiconductor is based on mutual trust and a shared commitment to advancing semiconductor technology innovation. The new collaboration brings together both teams to further strengthen this partnership and accelerate technology development to address unprecedented complexities in chip manufacturing blueprints. Miyu Jie, Executive Vice President and Co-COO of Taiwan Semiconductor, stated that as semiconductor component architectures evolve with each new generation, the demands for materials engineering and process integration continue to rise. In the face of global challenges brought by AI, the entire industry needs to work together. 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