---
title: "Hymson Laser Technology: Strong performance reversal + TGV equipment achieves the only domestic closed-loop breakthrough, building a globally leading barrier"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/287146815.md"
description: "Hymson Laser Technology expects to achieve a V-shaped turnaround in performance starting in 2026, with new signed orders reaching 5 billion yuan in the first quarter and an order gross margin stabilizing at 30%-35%. In the TGV equipment field, the company has reached the highest global mass production standards, becoming the only domestic manufacturer to achieve fully autonomous supply throughout the entire process, successfully entering the global high-end packaging supply chain and forming competitive barriers"
datetime: "2026-05-21T02:31:33.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/287146815.md)
  - [en](https://longbridge.com/en/news/287146815.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/287146815.md)
---

# Hymson Laser Technology: Strong performance reversal + TGV equipment achieves the only domestic closed-loop breakthrough, building a globally leading barrier

Starting from 2026, Hymson Laser Technology will experience a fundamental V-shaped reversal in performance, with a comprehensive recovery of its operational fundamentals. In the first quarter, the company signed new orders worth 5 billion yuan, with the total order scale exceeding 16 billion yuan. The gross profit margin of orders remains stable at a high range of 30%-35%, providing a solid foundation for the company's long-term stable growth with ample and high-margin order reserves.

In the core technology field of glass TGV through-hole equipment, Hymson Laser Technology has fully achieved the highest global mass production standards: through-hole roundness remains stable at over 98%, aspect ratio reaches the industry's top level of 150:1, through-hole taper is strictly controlled at <2°, verticality approaches 90°, minimum aperture ≤3μm with aperture tolerance ±1.5%, position accuracy deviation <±1μm, side wall roughness Ra<50nm, edge chipping <1μm with no hidden micro-cracks, single-hole processing efficiency ≥10,000 holes/second, and overall wafer through-hole yield ≥99.5%, with copper filling void rate <0.5%. All core parameters are at the global top level.

Relying on its self-developed ultra-fast frequency doubling laser system, covering infrared and ultraviolet multi-band light sources, combined with the independently controlled core process of laser-induced deep etching (LIDE), Hymson Laser Technology achieves full chain autonomy from laser source, laser processing technology to wet etching. It is the only domestic manufacturer to realize a fully closed-loop autonomous supply for TGV equipment, with lasers completely self-developed and produced, and the wet etching process independently developed by its core team, completely eliminating dependence on external procurement and cooperation; in contrast, other domestic equipment manufacturers generally purchase lasers externally and commonly adopt external cooperation models for wet etching, failing to form a fully autonomous controllable capability across the entire chain.

With its unique technical strength and rigorous product validation, Hymson Laser Technology has become the only equipment manufacturer in China certified by leading North American computing power companies (Code), successfully entering the global high-end advanced packaging core supply chain, forming an exclusive and irreplaceable competitive barrier in high-value sectors such as AI computing power, CoWoS glass interlayer, and TGBI optical interconnect, accelerating the process of domestic substitution

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