The chip sector experiences a 20cm limit-up surge! Huawei releases the "Tao Law," domestic chips aim for 1.4 nanometer equivalent levels, the China Universal SSE STAR Chip ETF (588750) rises by 6.6%, and Dosilicon and Hua Hong hit the 20cm limit-up

On May 25, major stock indices rose across the board, with the chip sector experiencing a comprehensive explosion, led by Huawei HiSilicon, AI chips, and storage chips. As of 14:26, the China Universal SSE STAR Chip ETF (588750) rose by 6.60%, with a transaction amount of 305 million; among the samples, Dosilicon and Hua Hong hit the 20% daily limit, Shengmei Shanghai rose over 19%, and SMIC and Tuojing Technology rose over 17%.

As of the previous trading day, the China Universal SSE STAR Chip ETF (588750) had a weekly increase of 6.12%, a monthly increase of 31.14%, a three-month increase of 36.06%, a six-month increase of 69.77%, and a yearly increase of 141.63%. The past performance has been outstanding.

Data shows that as of the previous trading day, the latest scale of the China Universal SSE STAR Chip ETF (588750) reached 5.961 billion yuan, with a total net inflow of 1.353 billion yuan in the past year.

The chip industry is welcoming a dual catalyst of intensive policies and technologies.

On the policy front, on May 22, relevant individuals emphasized the need to promote the extensive and deep integration of artificial intelligence with various fields of the economy and society, guiding domestic large models to increase efforts to adapt to domestic computing power chips, ensuring that the industry remains self-controlled and stable while maintaining rapid development.

On the technology front, on May 25, Huawei officially announced the "Tao (T) Law," which is a new principle for industrial development proposed for the first time in China's global semiconductor field. It is reported that Huawei will release a new Kirin mobile phone chip this autumn, fully adopting logic folding technology to significantly enhance performance; it is expected that by 2031, the transistor density of high-end chips based on this law will reach the equivalent level of 1.4 nm process.

IDC predicts that the global semiconductor market size is expected to reach 1.29 trillion USD by 2026, breaking the trillion-dollar mark four years earlier than previously expected. As the core area of global capacity expansion, the market share of domestic equipment suppliers in China is increasing at a rate far exceeding expectations: from 10% in 2020 to 26% in 2025, and is expected to reach 32%, 36%, and 40% in 2026 to 2028, respectively.

Changjiang Securities research report points out that the current domestic models have entered a demand era, continuously improving capabilities while accelerating the adaptation of chips and models. With the mass launch of Huawei Ascend 950 super nodes in the second half of the year, domestic computing power will welcome a critical turning point with practical application value, and there is optimism about the comprehensive resonance of domestic models and computing power.

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