LOONGSON TECHNOLOGY plans to raise 2.3 billion yuan to enhance research and development of advanced process chips; the ChinaAMC SSE STAR Semiconductor Material & Equipment Thematic ETF (588170), which has the highest content of advanced packaging, rose by 0.74%

As of May 28, 2026, 11:11, the ChinaAMC SSE STAR Semiconductor ETF (588170) rose by 0.74%, and the ChinaAMC SSE Semiconductor Equipment ETF (562590) rose by 0.41%. China Shipbuilding Industry Corporation Special Gas rose by 10.54%, Shanghai Silicon Industry rose by 8.19%, Semiconductor Manufacturing International Corporation rose by 6.14%, Xingfu Electronics rose by 5.65%, and Olin New Materials rose by 4.93%.

In terms of news, LOONGSON TECHNOLOGY announced that the company plans to raise no more than 2.3 billion yuan, which will be used for the research and development and industrialization projects of information technology chips based on Xnm process, key core technology research and development projects for CPUs, key core technology research and development projects for general GPUs, and to supplement working capital after deducting issuance costs.

Related ETFs: ChinaAMC SSE STAR Semiconductor ETF (588170) and its feeder funds (Class A: 024417; Class C: 024418): The tracking index is the only semiconductor equipment thematic index on the STAR Market, with nearly 80% of the content in memory chips and the highest advanced packaging content in the entire market (about 59%), focusing on hardcore equipment companies at the forefront of technological innovation.

ChinaAMC SSE Semiconductor Equipment ETF (562590) and its feeder funds (Class A: 020356; Class C: 020357): The tracking index is the CSI Semiconductor Material & Equipment Thematic Index, where the content of semiconductor equipment is the highest among all market indices (about 63%), directly benefiting from the global chip price surge and the certain demand for "shovel sellers" (equipment manufacturers)