--- title: "Intel Bets on Glass Substrates: $3.3 Billion Plant in India with Annual Capacity of 70,000 Wafers" type: "News" locale: "en" url: "https://longbridge.com/en/news/288237556.md" description: "Intel joins forces with 3DGS to invest $3.3 billion in a glass substrate factory in Odisha, India, with an expected annual capacity of 70,000 wafers. Meanwhile, a mass production base in New Mexico is also in preparation, accelerating commercialization in both locations. As Taiwan Semiconductor, Samsung Electronics, and SKC compete, glass substrates are moving from the lab to large-scale production, quietly accelerating the material revolution for next-generation AI chip packaging" datetime: "2026-06-01T08:16:26.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/288237556.md) - [en](https://longbridge.com/en/news/288237556.md) - [zh-HK](https://longbridge.com/zh-HK/news/288237556.md) --- # Intel Bets on Glass Substrates: $3.3 Billion Plant in India with Annual Capacity of 70,000 Wafers Intel is accelerating its strategic layout for glass substrates, positioning India as a key production base. According to a Monday report by TrendForce, the Indian government announced that Intel and 3DGS plan to invest approximately $3.3 billion in building a substrate manufacturing plant in Odisha, eastern India. **The project is located in the Bhubaneswar-Khurda region, with a construction period estimated at five to six years, focusing on advanced packaging glass core substrates, high-density interconnect substrates, and related semiconductor technologies.** Citing Indian government data, The Next Web reported that once completed, the factory is expected to produce approximately 70,000 glass substrate wafers annually, along with about 50 million assembled units and nearly 13,000 advanced 3D heterogeneous integration modules. This move marks a critical step in Intel's commercialization of glass substrates and reflects the fierce competition among global tech giants over next-generation packaging materials. ## Plant Construction in India: Intel and 3DGS Jointly Establish Presence in Odisha Founded in 2005, 3DGS is a US semiconductor technology company. According to STAR Market Daily, the packaging facility supported by Intel officially broke ground in April this year in Bhubaneswar, the capital of Odisha. This $3.3 billion investment plan covers two core areas: advanced packaging glass core substrates and high-density interconnect substrates. With a construction timeline spanning five to six years, it demonstrates Intel's long-term commitment to this technological route. As an emerging hub for India's semiconductor industry, Odisha is gradually attracting top global enterprises to set up operations. Intel's glass substrate strategy is not limited to India. According to Forbes, **Rio Rancho, New Mexico, is poised to become Intel's first mass production base for glass substrates and may rank among the first such facilities globally.** Currently, Intel produces glass substrates only through a pilot line located in Chandler. The parallel advancement in both locations indicates that Intel is attempting to simultaneously build R&D and mass production capabilities in the emerging field of glass substrates to cope with the rapidly growing demand for AI chip packaging in the future. ## Taiwan Semiconductor, Samsung Electronics, and SKC Accelerate Glass Substrate Commercialization Intel is not fighting alone. Global tech giants are competing to push glass substrates toward commercialization. According to the Economic Daily News, Taiwan Semiconductor has named its panel-level packaging technology CoPoS (Chip-on-Panel-on-Substrate). The core shift involves moving from traditional circular wafers to square glass or organic substrates, with mass production potentially starting as early as 2028. In South Korea, Business Post reported that **SKC and its subsidiary Absolics are expected to launch the world's first commercial production of glass substrates by the end of 2026.** The Elec reported that Samsung Electro-Mechanics is operating a glass substrate pilot line at its Sejong factory in South Chungcheong Province, with mass production targets set for after 2027. Furthermore, according to the Commercial Times, Taiwanese manufacturers pointed out that the strong demand for large-capacity storage in AI servers is driving hard drive technology toward Heat-Assisted Magnetic Recording (HAMR). Since HAMR involves high-temperature processes, heat-resistant glass substrates are expected to replace traditional aluminum platters, opening up another incremental market for glass substrates beyond semiconductor packaging. ### Related Stocks - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [SMSN.UK](https://longbridge.com/en/quote/SMSN.UK.md) - [04335.HK](https://longbridge.com/en/quote/04335.HK.md) - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [SSNGY.US](https://longbridge.com/en/quote/SSNGY.US.md) - [07747.HK](https://longbridge.com/en/quote/07747.HK.md) - [09747.HK](https://longbridge.com/en/quote/09747.HK.md) - [XSD.US](https://longbridge.com/en/quote/XSD.US.md) - [TSMZ.US](https://longbridge.com/en/quote/TSMZ.US.md) - [TSMU.US](https://longbridge.com/en/quote/TSMU.US.md) - [INTW.US](https://longbridge.com/en/quote/INTW.US.md) - [SMH.US](https://longbridge.com/en/quote/SMH.US.md) - [TSMX.US](https://longbridge.com/en/quote/TSMX.US.md) - [SOXX.US](https://longbridge.com/en/quote/SOXX.US.md) - [RSPT.US](https://longbridge.com/en/quote/RSPT.US.md) - [SOXL.US](https://longbridge.com/en/quote/SOXL.US.md) - [07347.HK](https://longbridge.com/en/quote/07347.HK.md) - [09347.HK](https://longbridge.com/en/quote/09347.HK.md) - [TSMG.US](https://longbridge.com/en/quote/TSMG.US.md) ## Related News & Research - [Intel Joins $3.3 Billion India Semiconductor Project](https://longbridge.com/en/news/288272861.md) - [Bruni J V & Co. 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