--- title: "Glass Substrates Expected to Commercialize in 2027, with NVIDIA and Alphabet Poised to Be Early Adopters" type: "News" locale: "en" url: "https://longbridge.com/en/news/288829203.md" description: "As AI chips evolve, glass substrates are becoming the focus of next-generation advanced packaging. Rising costs for Taiwan Semiconductor's CoWoS are accelerating the adoption of this technology. The company has established a CoPoS pilot production line, aligning with industry forecasts of early commercialization in 2027 and full-scale mass production by 2030. Currently, NVIDIA and Alphabet are likely to be the first adopters, while giants such as Intel, Samsung Electro-Mechanics, and SKC are racing to secure positions in this new track" datetime: "2026-06-05T08:21:53.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/288829203.md) - [en](https://longbridge.com/en/news/288829203.md) - [zh-HK](https://longbridge.com/zh-HK/news/288829203.md) --- # Glass Substrates Expected to Commercialize in 2027, with NVIDIA and Alphabet Poised to Be Early Adopters As AI chips continue to evolve toward larger sizes and higher complexity, competition in next-generation packaging and substrate technologies is intensifying, with glass substrates emerging as an industry focal point. According to Korean media reports, **glass substrates are expected to begin early commercialization in 2027, enter a capacity ramp-up phase in 2029, and officially commence full-scale mass production from 2030.** The report points out that NVIDIA and Alphabet are the most likely end customers to adopt this technology first, as both companies are the most influential players in the AI accelerator chip market. This timeline largely aligns with recent statements by C.C. Wei, Chairman of Taiwan Semiconductor. According to Wei's remarks at the shareholders' meeting on June 4, Taiwan Semiconductor has established a CoPoS pilot production line and expects meaningful capacity increases within two to three years. Taiwan Semiconductor's entry further confirms that the commercialization path for glass substrates, moving from the laboratory to mass production, is accelerating. At the market level, the continuously rising cost of Taiwan Semiconductor's silicon-based CoWoS packaging is seen as a significant catalyst accelerating the adoption of glass substrates. As Intel, Samsung Electro-Mechanics, Absolics (a subsidiary of SKC), LG Innotek, and others accelerate their layout, the competitive landscape of this track is taking shape. ## Rising CoWoS Costs Strengthen the Logic for Glass Substrate Demand According to an analysis by Sisa Journal, the continuous high-intensity investment by hyperscale cloud computing enterprises in next-generation infrastructure and advanced packaging is the core driver behind the demand for glass substrates. **Compared to traditional organic substrates, glass substrates offer superior heat resistance and warpage resistance, providing scalable advantages for interconnecting GPUs and HBM at larger sizes and higher densities.** Cost factors are also not to be overlooked. The average selling price of a Taiwan Semiconductor CoWoS wafer is approximately $10,000, comparable to advanced 7nm process nodes, highlighting that advanced packaging has evolved into a high-value-added competitive segment. Sisa Journal points out that the continuous increase in the unit cost of CoWoS is driving customers to evaluate alternative packaging routes centered on glass substrates. A report by TrendForce shows that Taiwan Semiconductor launched its 310×310 mm CoPoS (Chip-on-Panel-on-Substrate) platform in 2025, using glass as the interposer material, further validating the technical feasibility of glass substrates in high-end packaging. ## Taiwan Semiconductor and Intel Clarify Roadmaps Among major platform providers, Taiwan Semiconductor's CoPoS pilot production line has entered a substantive advancement phase. At the shareholders' meeting, Wei stated that **meaningful capacity ramp-up is expected to be achieved within two to three years, a timeline that mutually corroborates industry forecasts for early commercialization in 2027.** According to Forbes, Intel's wafer fab in Rio Rancho, New Mexico, is currently producing silicon photonics products for external customers and has showcased the first prototypes of glass substrates integrated with co-packaged optics (CPO), with a commercialization target also set for around 2030. Intel's entry means that competition in the glass substrate track has extended from packaging firms to the wafer manufacturing end. ## Korean Manufacturers Race to Layout, with SKC Being the Most Aggressive Within the Korean camp, SKC, Samsung Electro-Mechanics, and LG Innotek are simultaneously accelerating preparations for mass production. According to Sisa Journal, **all three companies have begun production qualification testing with end customers, with SKC considered the most aggressive player.** SKC has completed a rights issue financing of KRW 1.2 trillion and plans to inject an additional KRW 589.6 billion into its glass substrate subsidiary, Absolics. Absolics recently launched a new project to supply "non-embedded" glass substrate prototypes to a U.S. telecommunications chip company. Absolics' glass substrates target the high-performance server and AI accelerator markets; compared to traditional organic interposers, they can reduce thickness by 25% and improve power efficiency by over 30%. Samsung Electro-Mechanics has a clearer path to mass production. Sisa Journal reports that Samsung Electro-Mechanics operates a glass substrate pilot production line at its Sejong factory in South Chungcheong Province, aiming to achieve mass production in the second half of 2027, and has already begun quality assessments with Broadcom and several hyperscale cloud computing enterprises. LG Innotek is also regarded as an emerging participant in this track. LG Innotek has established a pilot production line at its Gumi factory and reached an R&D cooperation agreement with UTI earlier this year, focusing on enhancing the mechanical strength of glass substrates. UTI is known for its Ultra-Thin Glass (UTG) used in foldable smartphones for brands like Samsung and is currently extending its glass processing technology to the substrate field. The report points out that this cross-industry layout may provide support for material technology upgrades in glass substrates. ### Related Stocks - [GOOG.US](https://longbridge.com/en/quote/GOOG.US.md) - [NVDA.US](https://longbridge.com/en/quote/NVDA.US.md) - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [GOOGL.US](https://longbridge.com/en/quote/GOOGL.US.md) - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [NVDL.US](https://longbridge.com/en/quote/NVDL.US.md) - [07788.HK](https://longbridge.com/en/quote/07788.HK.md) - [07388.HK](https://longbridge.com/en/quote/07388.HK.md) - [NVDY.US](https://longbridge.com/en/quote/NVDY.US.md) - [NVDD.US](https://longbridge.com/en/quote/NVDD.US.md) - [NVDX.US](https://longbridge.com/en/quote/NVDX.US.md) - [NVDQ.US](https://longbridge.com/en/quote/NVDQ.US.md) - [GGLS.US](https://longbridge.com/en/quote/GGLS.US.md) - [GGLL.US](https://longbridge.com/en/quote/GGLL.US.md) - [SOXL.US](https://longbridge.com/en/quote/SOXL.US.md) ## Related News & Research - [If You Want to Invest in AI Without Losing Sleep, Buy Google Stock Now](https://longbridge.com/en/news/288316541.md) - [Google’s Phone app will tell you if a scammer is impersonating one of your contacts](https://longbridge.com/en/news/288464543.md) - [Why Cathie Wood and Berkshire Hathaway Both Love Google Stock Here](https://longbridge.com/en/news/288896332.md) - [This Google Photos update has saved your digital photo frame](https://longbridge.com/en/news/288718826.md) - [3 things Broadcom and Nvidia investors should look for when Broadcom reports earnings on June 3](https://longbridge.com/en/news/288379869.md)