--- title: "Report: Samsung and NVIDIA Expand Cooperation, Negotiations Extend to HBM5 and Next-Generation Groq Chips" type: "News" locale: "en" url: "https://longbridge.com/en/news/289148483.md" description: "Samsung and NVIDIA are deepening their cooperation, with negotiations extending to HBM5 and the foundry production of next-generation Groq chips. The two parties are discussing HBM4/4E supply and advanced process foundry services, aiming to strengthen ties in the AI infrastructure supply chain" datetime: "2026-06-09T06:59:03.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/289148483.md) - [en](https://longbridge.com/en/news/289148483.md) - [zh-HK](https://longbridge.com/zh-HK/news/289148483.md) --- # Report: Samsung and NVIDIA Expand Cooperation, Negotiations Extend to HBM5 and Next-Generation Groq Chips Samsung Electronics and NVIDIA are pushing their bilateral cooperation to new depths, with the scope of negotiations expanding from current product lines to next-generation high-bandwidth memory (HBM) and chip foundry services. This marks a further strengthening of the strategic binding between these two tech giants in the AI infrastructure supply chain. According to TrendForce News on Tuesday, Samsung Electronics Vice Chairman Jun Young-hyun held talks with NVIDIA CEO Jensen Huang on June 8, where the two sides discussed potential cooperation in HBM and foundry services. **Jun Young-hyun stated that the immediate priority is to ensure the stable supply of HBM4 and SOCAMM this year. Meanwhile, the two sides also consulted on long-term cooperation starting next year, covering HBM4E, foundry services, and HBM5.** These talks took place after Jensen Huang’s high-profile visit to South Korea and a series of meetings with SK hynix, drawing significant attention to whether Samsung can consolidate its position in NVIDIA’s supply chain. Although Jun Young-hyun did not confirm whether the two sides would sign a long-term memory supply agreement, he stated, according to Newspim, that Samsung would do its utmost to support NVIDIA’s success as a key partner. ## Foundry Cooperation Extends to Next-Generation Groq Chips At the foundry business level, the scope of cooperation between Samsung and NVIDIA is expanding. Samsung is negotiating with NVIDIA on using advanced processes to produce next-generation chips, **involving the Drive AGX Thor autonomous driving chip and the Groq Language Processing Unit (LPU).** Jun Young-hyun stated that Samsung is currently producing autonomous driving and Groq chips for NVIDIA using 4nm and 8nm processes, with cooperation extending to the next generation of Groq chips. **Samsung is currently producing the third-generation Groq LPU (LP30) using the 4nm process. Jun Young-hyun’s remarks imply that Samsung also has the capability to produce the next-generation LP40—although the industry had previously widely expected TSMC to secure this order due to its advantages in advanced packaging.** NVIDIA CEO Jensen Huang also commented on the cooperation during the Q&A session at the NVIDIA Korea AI Ecosystem Reception. According to Dealsite, Huang stated that NVIDIA and Samsung have a long-standing cooperation in the ASIC field and are currently jointly developing new ASIC products. The two companies also have a long history of collaboration in memory technology. ## Memory Supply Covers the Entire Vera Rubin Platform Product Line In terms of memory business, Samsung has already provided multiple products for NVIDIA’s Vera Rubin platform. Samsung is supplying sixth-generation HBM4 memory with a data transfer rate of 11.7 Gbps for the platform; it is also providing LPDDR5X-based SOCAMM2 modules for the Vera CPU, as well as PCIe Gen6-based PM1763 storage solutions. Regarding next-generation products, Samsung’s HBM4E combines DRAM core chips with its self-developed 4nm foundry base die, achieving a transfer speed of 14 Gbps, with tests reaching up to 16 Gbps. If this technical specification can be successfully mass-produced, it will help Samsung compete more directly with SK hynix in the high-end HBM market. ## Long-Term Agreement Pending, Cooperation Framework Still Taking Shape Although the scope of cooperation between the two sides continues to expand, the key long-term supply agreement has not yet been finalized. **When asked whether a long-term memory supply agreement would be signed, Jun Young-hyun did not give a direct confirmation, adopting relatively cautious wording.** From a broader perspective, these talks covered multiple dimensions including HBM4, HBM4E, HBM5, foundry processes, and joint ASIC development, indicating that the cooperation between the two parties is evolving from single-product procurement to deeper technological synergy. For investors, whether Samsung can successfully secure the LP40 order on the foundry side and further increase its share in the HBM supply chain will be key indicators for measuring the substantive progress of this round of cooperation. Risk Warning and Disclaimer The market carries risks, and investment requires caution. This article does not constitute personal investment advice, nor does it take into account the specific investment objectives, financial status, or needs of individual users. Users should consider whether any opinions, views, or conclusions in this article align with their specific circumstances. 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