--- title: "Samsung Plans to Expand Advanced Packaging Capacity: May Announce Gwangju Plant Construction as Early as End of Month, First New Packaging Base in 35 Years" type: "News" locale: "en" url: "https://longbridge.com/en/news/289290997.md" description: "Samsung Electronics plans to build a new packaging plant in Gwangju, South Korea, marking its first new packaging base in 35 years, aimed at addressing resource limitations in the Seoul metropolitan area. Meanwhile, Samsung is significantly expanding HBM backend capacity at its Cheonan base, planning to fully switch stacking processes to HCB technology by 2029, and intends to invest $1.5 billion in testing facilities in Vietnam, making multi-pronged efforts in advanced packaging" datetime: "2026-06-10T07:57:25.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/289290997.md) - [en](https://longbridge.com/en/news/289290997.md) - [zh-HK](https://longbridge.com/zh-HK/news/289290997.md) --- # Samsung Plans to Expand Advanced Packaging Capacity: May Announce Gwangju Plant Construction as Early as End of Month, First New Packaging Base in 35 Years Samsung Electronics is accelerating its layout of advanced packaging capacity, planning to build a new packaging plant in Gwangju, South Korea. This will be the company's first new packaging base in 35 years and its first major new semiconductor production facility in 11 years since the launch of the Pyeongtaek campus. According to Korean media reports, Samsung is expected to officially announce the above investment plan as early as the end of this month at a meeting of leaders from major corporate groups hosted by South Korean President Lee Jae-myung. SK Group Chairman Chey Tae-won and other business leaders are expected to attend the meeting. **The new Gwangju plant will extend the geographical coverage of Samsung's packaging business from its traditional strongholds in Chungcheong Province—Asan Onyang and Cheonan—southward to the Honam region of Korea, marking a significant expansion node in its semiconductor manufacturing footprint.** At the same time, Samsung is significantly increasing HBM backend processing capacity and accelerating the construction of semiconductor testing bases in Vietnam. The multi-pronged approach in the field of advanced packaging reflects the accelerating evolution of the industry's competitive landscape. ## Accelerated Expansion of HBM Capacity: Cheonan Base Upgrade, Switch to HCB Technology by 2029 According to reports, Samsung selected Gwangju as the site for its new packaging base partly due to concerns that power and water resources in the Seoul metropolitan area are approaching their limits, with Gwangju standing out for its infrastructure capacity advantages. The construction of the new plant will create a new capacity support point in the Honam region outside the existing Chungcheong Province packaging system, further diversifying the geographical layout of Samsung's packaging network to meet the growing demand for advanced packaging. In terms of technological investment, Samsung is expanding the HBM backend processing capacity at its Cheonan facility, aiming to increase the monthly capacity of Thermal Compression Bonding (TCB) to 231,000 units and Hybrid Copper Bonding (HCB) to 19,500 units by the end of 2026. The report also pointed out that Samsung plans to fully switch the HBM stacking process route from TCB to HCB by 2029, highlighting its continued bet on next-generation advanced packaging technologies. Regarding overseas layout, a proposal document shows that Samsung Electronics plans to invest 39 trillion Vietnamese dong (approximately $1.5 billion) in Vietnam to build semiconductor testing facilities in an industrial park about 60 kilometers north of Hanoi. The project has already started construction and is expected to officially commence operations in November 2027. ### Related Stocks - [SSNGY.US](https://longbridge.com/en/quote/SSNGY.US.md) - [SMSN.UK](https://longbridge.com/en/quote/SMSN.UK.md) - [07747.HK](https://longbridge.com/en/quote/07747.HK.md) - [09747.HK](https://longbridge.com/en/quote/09747.HK.md) - [07347.HK](https://longbridge.com/en/quote/07347.HK.md) - [09347.HK](https://longbridge.com/en/quote/09347.HK.md) ## Related News & Research - [South Korea's metal workers' union plans to strike on July 15](https://longbridge.com/en/news/289295284.md) - [Samsung Elec invests $175 million to become top shareholder in US genetics firm](https://longbridge.com/en/news/289252261.md) - [Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs](https://longbridge.com/en/news/289297176.md) - [Samsung Electronics (SMSN): New Buy Recommendation for This Technology Giant](https://longbridge.com/en/news/288814097.md) - [Micron Stock Price Bounces Back from a 20% Plunge — What's Fueling the Comeback?](https://longbridge.com/en/news/289044258.md)