--- title: "Understanding the Market | PCB Concept Stocks Continue Recent Uptrend, NVIDIA Personally Engages in Purchasing HVLP4 Copper Foil, Pricing Power Has Concentrated Towards Upstream Materials" type: "News" locale: "en" url: "https://longbridge.com/en/news/289719436.md" description: "PCB concept stocks continue to rise, with stocks like KINGBOARD HLDG significantly increasing. NVIDIA bypasses copper-clad laminate manufacturers and directly locks in key upstream capacities such as HVLP4 copper foil, highlighting material scarcity. Citigroup's research report points out that the demand for AI servers drives pricing power upstream, with electronic fabric supply growing the slowest and having the greatest price elasticity, becoming the current bottleneck in the industry chain" datetime: "2026-06-15T02:30:04.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/289719436.md) - [en](https://longbridge.com/en/news/289719436.md) - [zh-HK](https://longbridge.com/zh-HK/news/289719436.md) --- # Understanding the Market | PCB Concept Stocks Continue Recent Uptrend, NVIDIA Personally Engages in Purchasing HVLP4 Copper Foil, Pricing Power Has Concentrated Towards Upstream Materials According to the Zhitong Finance APP, PCB concept stocks continue their recent upward trend. As of the time of writing, KINGBOARD HLDG (01888) is up 14.71%, trading at HKD 75.25; KINGBOARD (00148) is up 10.58%, trading at HKD 98.75; Shenghong Technology (02476) is up 7.5%, trading at HKD 407.2; and Guanghe Technology (01989) is up 6.35%, trading at HKD 172.6. In terms of news, according to media reports, NVIDIA and its major customers are bypassing copper-clad laminate (CCL) manufacturers and directly connecting with HVLP4 copper foil and T-glass fiberglass cloth suppliers, locking in key production capacity more than a year in advance through a direct consignment model. Industry insiders have revealed that NVIDIA is also exerting greater procurement pressure on U.S. cloud service providers. Meanwhile, CCL suppliers have implemented rare quota distribution measures, requiring IC substrate and PCB manufacturers to take goods based on actual usage, further highlighting the scarcity of upstream materials. Additionally, Citigroup's latest research report points out that the demand for PCBs from AI servers is shifting from quantity growth to material upgrades, and the real bottleneck in supply is no longer the PCB manufacturers, but rather the upstream copper-clad laminates and even further upstream electronic fabrics. Citigroup predicts that the fastest capacity growth will be in PCBs, followed by copper-clad laminates, with electronic fabrics growing the slowest. 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