--- title: "Nexchip Semiconductor Plans 216.17 Million Share Hong Kong IPO at Up to HK$32.30" type: "News" locale: "en" url: "https://longbridge.com/en/news/291201592.md" description: "Nexchip Semiconductor said in a Hong Kong Stock Exchange filing that it plans a global offering of 216,167,000 H shares, with an offer price of no more than HK$32.30 per share, according to 36Kr. The company expects its shares to begin trading on the Hong Kong Stock Exchange on July 10, 2026." datetime: "2026-06-30T00:08:35.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/291201592.md) - [en](https://longbridge.com/en/news/291201592.md) - [zh-HK](https://longbridge.com/zh-HK/news/291201592.md) generator: "portal-rs" --- # Nexchip Semiconductor Plans 216.17 Million Share Hong Kong IPO at Up to HK$32.30 Nexchip Semiconductor said in a Hong Kong Stock Exchange filing that it plans a global offering of 216,167,000 H shares, with an offer price of no more than HK$32.30 per share, according to 36Kr. The company expects its shares to begin trading on the Hong Kong Stock Exchange on July 10, 2026. ### Related Stocks - [688249.CN](https://longbridge.com/en/quote/688249.CN.md) - [KRKR.US](https://longbridge.com/en/quote/KRKR.US.md) ## Related News & Research - [NEXCHIPStarts IPO Today; Entry Fee HKD3,262.57; Net Proceeds HKD6.536B; 20 Cornerstone Investors Incl. CHERY AUTO, Hillhouse](https://longbridge.com/en/news/291211417.md) - [BQE Water Inc. Just Missed EPS By 24%: Here's What Analysts Think Will Happen Next](https://longbridge.com/en/news/297432071.md) - [JSL publishes 2025 integrated annual report](https://longbridge.com/en/news/297521780.md) - [The Calmer Co. Details ASX Governance Compliance in Appendix 4G Filing](https://longbridge.com/en/news/297454626.md) - [NewHydrogen, UCSB file third provisional patent for ThermoLoop hydrogen process](https://longbridge.com/en/news/297613273.md) --- > **Disclaimer: This article is for reference only and does not constitute any investment advice.**