DR Laser: The company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology
DR Laser: The company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology
Finet HK
On July 15th, DR Laser (300776.SZ) stated on the interactive platform that the company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology, and has completed the shipment of panel-level glass substrate through-hole equipment
