---
title: "DR Laser: The company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/292716747.md"
description: "On July 15th, DR Laser stated on the interactive platform that the company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology, and has completed the shipment of panel-level glass substrate through-hole equipment"
datetime: "2026-07-15T05:38:16.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/292716747.md)
  - [en](https://longbridge.com/en/news/292716747.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/292716747.md)
generator: "portal-rs"
---

# DR Laser: The company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology

On July 15th, DR Laser (300776.SZ) stated on the interactive platform that the company's TGV laser micro-hole equipment has achieved comprehensive coverage of wafer-level and panel-level packaging laser technology, and has completed the shipment of panel-level glass substrate through-hole equipment

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**