--- title: "Did AMD also place an order? It is reported that Intel's 18A yield has improved, winning multiple design orders" type: "News" locale: "en" url: "https://longbridge.com/en/news/292725891.md" description: "According to a KeyBanc report, Intel's 18A process yield has risen to 85%, surpassing Samsung's SF2. Market rumors suggest that Intel has secured foundry orders from giants such as AMD, Nvidia, and OpenAI, and may internalize most of the production capacity for the next-generation Nova Lake chips instead of outsourcing it to Taiwan Semiconductor" datetime: "2026-07-15T07:10:40.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/292725891.md) - [en](https://longbridge.com/en/news/292725891.md) - [zh-HK](https://longbridge.com/zh-HK/news/292725891.md) generator: "portal-rs" --- # Did AMD also place an order? It is reported that Intel's 18A yield has improved, winning multiple design orders Market rumors suggest that as the yield of the advanced process 18A rises to 85%, Intel has secured wafer foundry orders from tech giants such as AMD, Nvidia, and OpenAI. Wccftech reported on the 14th that according to research reports provided by netizens John Intel and Alex, the well-known investment bank KeyBanc Capital Markets pointed out that the yield of Intel's most critical "Intel 18A" process has steadily increased from 65% to 85%. Although this figure still lags behind TSMC's "N2" process yield level of 90%, it has clearly surpassed Samsung Foundry's "SF2" process yield performance of 50% to 60%. > I really wanna highlight the important parts but everything is important $INTC pic.twitter.com/2uiPvaZ5NC > > — John Intel (@intelfabs) July 14, 2026 > Interesting NVL claim $INTC > > “INTC had been planning to outsource 60-70% of Nova Lake (next-generation PC DT CPU) tiles to TSMC at N2. However, we believe given the performance and yield improvements related to 18A, we expect INTC to insource 80-90% of Nova Lake tiles to IFS." https://t.co/M65l6fVprQ pic.twitter.com/YtWs6LPXb6 > > — Alex (@Alex\_Intel\_) July 14, 2026 It is understood that the R&D progress of Intel's 14A process is still on schedule, and its performance in defect density control is better than that of 18A, with mass production expected to commence in the second half of 2028. Benefiting from the improvement in the yield of the 18A process, along with rising quotes from TSMC, KeyBanc estimates that Intel will revert 80% to 90% of the orders for the next-generation desktop CPU "Nova Lake" tiles to be produced by Intel Foundry Services (IFS). Previously, due to performance optimization issues with the 18A process, Intel had planned to outsource about 60% to 70% of the Nova Lake tile orders to TSMC for production using the N2 process KeyBanc believes that Intel's decisions are also influenced by the following factors: First, the increasing competitive threat of Intel's wafer foundry services against Taiwan Semiconductor Manufacturing Company (TSMC) has led to less favorable pricing conditions for Intel's N2 process compared to other customers; second, in the face of intensifying competition, KeyBanc believes that Intel's support for optimizing Nova Lake chips using the N2 process is relatively limited. With new customers continuously joining and a surge in demand for generative AI, Intel plans to significantly expand its foundry capacity for the 18A and Intel 3 processes (used for Granite Rapids chips). KeyBanc pointed out that in addition to successfully securing Apple to use the 18A and 14A processes for its low-end M series processors, Intel has also won foundry design orders from customers such as AMD, NVIDIA, Marvell, Microsoft, Micron, and OpenAI. Additionally, it is understood that Intel has raised some wafer foundry equipment orders by 30% to 40%. KeyBanc also noted that following Google's TPU v9 (Humufish) processor, Intel has once again secured a significant design order in EMIB-T packaging technology, this time for Amazon Web Services' (AWS) Trainium 3 chip. (This article is authorized for reprint by MoneyDJ News; the main image source: Intel) ### Further Reading: - Reports suggest the Trump administration urged Intel to expand advanced packaging and compete with TSMC. - Intel's outsourcing strategy to TSMC has taken a major turn, with most Nova Lake computing chips returning to Intel's 18A manufacturing. - ASML announces Intel's adoption of High NA EUV technology as Intel's 18A advanced process enters high-volume production stage. - Intel's advanced process reportedly shows progress, with Intel 18A yield improvement and Intel 14A expected to enter mass production in 2029. - Intel admits it pushed Intel 18A too quickly beyond its capabilities, but Intel 14A benefits from smooth progress ### Related Stocks - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [04335.HK](https://longbridge.com/en/quote/04335.HK.md) - [AMD.US](https://longbridge.com/en/quote/AMD.US.md) - [NVDA.US](https://longbridge.com/en/quote/NVDA.US.md) - [TSM.US](https://longbridge.com/en/quote/TSM.US.md) - [INTW.US](https://longbridge.com/en/quote/INTW.US.md) - [NVDU.US](https://longbridge.com/en/quote/NVDU.US.md) - [AMUU.US](https://longbridge.com/en/quote/AMUU.US.md) - [NVDX.US](https://longbridge.com/en/quote/NVDX.US.md) - [NVDL.US](https://longbridge.com/en/quote/NVDL.US.md) - [AMDL.US](https://longbridge.com/en/quote/AMDL.US.md) - [NVDQ.US](https://longbridge.com/en/quote/NVDQ.US.md) - [TSMZ.US](https://longbridge.com/en/quote/TSMZ.US.md) - [NVDD.US](https://longbridge.com/en/quote/NVDD.US.md) - [07788.HK](https://longbridge.com/en/quote/07788.HK.md) - [NVD.US](https://longbridge.com/en/quote/NVD.US.md) - [NVDS.US](https://longbridge.com/en/quote/NVDS.US.md) - [TSMX.US](https://longbridge.com/en/quote/TSMX.US.md) - [AMDD.US](https://longbridge.com/en/quote/AMDD.US.md) - [NVDY.US](https://longbridge.com/en/quote/NVDY.US.md) - [AMDG.US](https://longbridge.com/en/quote/AMDG.US.md) - [DAMD.US](https://longbridge.com/en/quote/DAMD.US.md) - [AMDY.US](https://longbridge.com/en/quote/AMDY.US.md) - [AMDW.US](https://longbridge.com/en/quote/AMDW.US.md) - [LINT.US](https://longbridge.com/en/quote/LINT.US.md) - [INYY.US](https://longbridge.com/en/quote/INYY.US.md) - [NVDB.US](https://longbridge.com/en/quote/NVDB.US.md) - [NVDG.US](https://longbridge.com/en/quote/NVDG.US.md) - [NVDO.US](https://longbridge.com/en/quote/NVDO.US.md) - [NVDW.US](https://longbridge.com/en/quote/NVDW.US.md) - [NVYY.US](https://longbridge.com/en/quote/NVYY.US.md) - [NYYY.US](https://longbridge.com/en/quote/NYYY.US.md) - [07388.HK](https://longbridge.com/en/quote/07388.HK.md) - [DIPS.US](https://longbridge.com/en/quote/DIPS.US.md) - [09388.HK](https://longbridge.com/en/quote/09388.HK.md) - [MAGX.US](https://longbridge.com/en/quote/MAGX.US.md) - [STSM.US](https://longbridge.com/en/quote/STSM.US.md) - [TMYY.US](https://longbridge.com/en/quote/TMYY.US.md) - [TSMG.US](https://longbridge.com/en/quote/TSMG.US.md) - [TSMU.US](https://longbridge.com/en/quote/TSMU.US.md) - [TSMY.US](https://longbridge.com/en/quote/TSMY.US.md) - [02330.HK](https://longbridge.com/en/quote/02330.HK.md) - [SSNGY.US](https://longbridge.com/en/quote/SSNGY.US.md) - [AAPL.US](https://longbridge.com/en/quote/AAPL.US.md) - [MRVL.US](https://longbridge.com/en/quote/MRVL.US.md) - [MSFT.US](https://longbridge.com/en/quote/MSFT.US.md) - [MU.US](https://longbridge.com/en/quote/MU.US.md) - [GOOGL.US](https://longbridge.com/en/quote/GOOGL.US.md) - [GOOG.US](https://longbridge.com/en/quote/GOOG.US.md) - [AMZN.US](https://longbridge.com/en/quote/AMZN.US.md) - [ASML.US](https://longbridge.com/en/quote/ASML.US.md) - [NVD.DE](https://longbridge.com/en/quote/NVD.DE.md) - [SMSN.UK](https://longbridge.com/en/quote/SMSN.UK.md) ## Related News & Research - [AMD Is Building an AI ‘Escape Hatch’ From Nvidia. 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