--- title: "SK Hynix and Sandisk Release World's First HBF Standard Specification, Google Joins Ecosystem" type: "News" locale: "en" url: "https://longbridge.com/en/news/294768270.md" description: "SK Hynix and Sandisk have jointly released the world's first standard specification for High Bandwidth Flash (HBF), marking an acceleration in the standardization of AI storage technology. Google and Tenstorrent have joined the HBF Alliance. The specification supports capacities of up to 512GB and bandwidths of 3.0TB/s, utilizing the UCIe interface to address bandwidth and capacity bottlenecks in AI inference scenarios" datetime: "2026-08-04T04:27:25.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/294768270.md) - [en](https://longbridge.com/en/news/294768270.md) - [zh-HK](https://longbridge.com/zh-HK/news/294768270.md) generator: "portal-rs" --- # SK Hynix and Sandisk Release World's First HBF Standard Specification, Google Joins Ecosystem SK Hynix joins hands with Sandisk, making a strategic move in the race for artificial intelligence storage architectures. On August 4, SK Hynix and Sandisk jointly released the world's first standard specification for High Bandwidth Flash (HBF). This milestone comes just six months after the formal establishment of the HBF Alliance, signaling that the standardization process for next-generation AI storage technology has officially accelerated. The aforementioned specification was officially unveiled at the "FMS 2026" storage summit held in Santa Clara, California. Google and Tenstorrent have announced their participation in the HBF Alliance, further expanding the industrial ecosystem coverage of this technology. Kim Chun-sung, Executive Vice President at SK Hynix, stated, **HBF will break down the boundaries between memory and storage, helping to build new architectures that enhance overall system efficiency.** **HBF technology is positioned as a new storage tier between High Bandwidth Memory (HBM) and Solid State Drives (SSDs), aiming to simultaneously address bandwidth bottlenecks and capacity expansion challenges in AI inference scenarios.** Previously, in April, Jukan, an analyst at Citrini Research, pointed out on the social platform X that **Google is currently the most active player in driving the implementation of HBF, while NVIDIA's interest in HBF is relatively limited, believing that existing eSSDs can already meet the corresponding bandwidth requirements.** ## First HBF Standard Specification Officially Implemented The newly released HBF standard specification is the latest result of the preliminary standardization partnership established between SK Hynix and Sandisk in August 2025, coming just six months after the alliance was officially launched in February of this year. The specification covers multiple core technical dimensions: > - **In terms of capacity**, it supports specifications of up to 512GB based on two stacking configurations (8-layer and 16-layer NAND dies); > - **In terms of bandwidth**, it is divided into three grades (Grade 1 to 3), with scalable performance ranging from approximately 0.4TB/s to 3.0TB/s. > - Additionally, the specification covers connection interfaces and electrical characteristics, reliability and packaging guidelines for HBF die stacking processes, as well as software I/O guidelines. Regarding interconnection standards, HBF adopts UCIe (Universal Chiplet Interconnect Express), an industry open standard, laying the foundation for the flexible integration of HBF technology across different processor types such as GPUs and CPUs. **In promoting the standardization of HBF, SK Hynix has adopted a parallel path of open alliances and industry collaboration.** Alliance members now include Google and Tenstorrent, and the specification is being disclosed to the entire industry as an open standard through the Open Compute Project (OCP), with the intention of shaping HBF into a universal industry standard. SK Hynix stated that it will leverage this specification release to promote the adoption of HBF technology in the AI storage market and continue to cultivate the surrounding ecosystem. The goal is to further expand the scale of the alliance and enhance technological maturity and market acceptance based on open collaboration. ## Technical Positioning: Filling the Gap Between HBM and SSDs **As the scale of AI inference applications continues to expand and the volume of data to be processed grows sharply, a single type of storage struggles to meet the dual demands of high bandwidth and large capacity, thus bringing HBF into the market spotlight.** HBF technology significantly expands capacity through NAND technology while achieving high-speed data transmission close to HBM levels, providing a balanced solution for both bandwidth and capacity scalability. SK Hynix defines it as a key component of the "Tiered Memory" architecture, a conceptual framework that connects and optimizes various storage types into a unified system. SK Hynix Executive Vice President Kim Chun-sung and Vice President Kang Uk-song will deliver a joint keynote speech titled "Building Efficient AI Infrastructure Through Tiered Memory in the Agentic AI Era" on the opening day of FMS 2026, elaborating on the necessity and development direction of next-generation storage architectures. On August 6, SK Hynix Vice President Lim Eui-cheol, Sandisk Vice President Rajeev Nagabhirava, and Google DeepMind Senior Engineer Xiaoyu Ma will jointly participate in a panel discussion titled "Breaking the Memory Wall with HBF." ## Debut of 10th Generation 4D NAND At the FMS 2026 booth, SK Hynix also publicly displayed its developing 10th generation (V10) 375-layer 4D NAND wafers and products for the first time. Compared to the previous generation, the 375-layer 4D NAND offers a 2.5x improvement in performance per watt, optimized specifically for AI infrastructure environments such as data centers that have stringent requirements for high energy efficiency and high performance. SK Hynix plans to start mass production of high-performance, large-capacity eSSDs based on this technology early next year to consolidate its leading position in the AI NAND market. In addition, the SK Hynix booth will showcase a diversified product line covering mobile, PC, automotive, and robotics sectors, demonstrating the results of its collaborative innovation with customers in the AI era. Risk Warning and Disclaimer The market carries risks; investment should be approached with caution. This article does not constitute personal investment advice, nor does it take into account the specific investment objectives, financial status, or needs of individual users. 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