---
title: "Broadcom Seeks Over $60 Billion in Debt Financing to Provide Chip Infrastructure for AI Firms Like Anthropic"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/296537894.md"
description: "Broadcom is in talks with Blackstone and Apollo Global, planning to raise over $60 billion in debt financing through a special purpose vehicle (SPV), with the total scale potentially reaching $100 billion, to support the construction of AI chip infrastructure represented by Anthropic. This transaction continues the \"AI XPV Partnership\" framework established by the three parties in June this year"
datetime: "2026-08-20T21:22:10.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/296537894.md)
  - [en](https://longbridge.com/en/news/296537894.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/296537894.md)
generator: "portal-rs"
---

# Broadcom Seeks Over $60 Billion in Debt Financing to Provide Chip Infrastructure for AI Firms Like Anthropic

Broadcom is seeking over $60 billion in financing to fund artificial intelligence chip infrastructure.

On August 20, Bloomberg cited insiders revealing that Broadcom is in negotiations with Blackstone and Apollo Global Management to raise over $60 billion in debt for an AI chip financing deal, with beneficiaries including Anthropic and other companies.

**According to reports, under the currently discussed plan, the financing structure may include approximately $60 billion to $70 billion in senior secured tranches and about $30 billion in subordinated debt tranches. If combined, the total scale could reach as high as $100 billion.** The financing plan is still under negotiation, and details are subject to change.

The financing is intended to issue debt through a special purpose vehicle (SPV), with Broadcom providing guarantees for part of the senior secured tranche. Once this massive funding is secured, it will have a profound impact on the financing landscape for AI infrastructure construction.

The three parties had previously reached a partnership agreement in June of this year to jointly provide financing support for computing infrastructure. The proposed transaction is similar in structure to the first completed $35 billion debt agreement under this cooperation framework, which served as the launchpad for the three parties' "AI XPV Partnership."

## Anthropic Seeks to Lock in Computing Power, While Broadcom Looks to Expand Chip Market Share

Behind this financing deal lies a dual logic where AI companies and chip manufacturers each have their own agendas.

**For Anthropic**, the developer of the Claude platform is becoming increasingly proactive in participating in the construction of computing power infrastructure, attempting to ensure sufficient computing capacity for model training and inference by locking in chip resources in advance.

If the financing is successfully completed, it will help Anthropic and other participants acquire chips and key AI infrastructure.

**For Broadcom**, this move aims to expand the sales volume of chips and data center equipment, strengthening its challenge to NVIDIA in this lucrative market.

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**