--- title: "Xiaomi Unveils Three Chips, Extending Self-Developed Chip Strategy from Smartphones to Automobiles" type: "News" locale: "en" url: "https://longbridge.com/en/news/296777343.md" description: "Xiaomi is continuing to expand its self-developed chip strategy beyond smartphone SoCs. On August 24, Xiaomi simultaneously released three Xuanjie self-developed chips: a SoC for flagship smartphones" datetime: "2026-08-24T11:06:07.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/296777343.md) - [en](https://longbridge.com/en/news/296777343.md) - [zh-HK](https://longbridge.com/zh-HK/news/296777343.md) generator: "portal-rs" --- # Xiaomi Unveils Three Chips, Extending Self-Developed Chip Strategy from Smartphones to Automobiles Xiaomi is continuing to expand its self-developed chip strategy beyond smartphone SoCs. On August 24, Xiaomi simultaneously released three Xuanjie self-developed chips: the Xuanjie O3 SoC for flagship smartphones, the Xuanjie O100 high-bandwidth AI acceleration chip for edge-side large model computing, and the Xuanjie D100 high-computing-power chip for intelligent driving. Among them, the Xuanjie O3 continues to follow the roadmap for primary smartphone chips and will be first deployed on the Xiaomi 18 Fold this September, supporting the Xiaomi MiMo multimodal model. The O100 is an AI acceleration chip specifically designed for large model inference, with no first mass-produced device announced yet. The D100 primarily targets automotive intelligent driving computing, and its debut vehicle model has also not been announced. Both the O100 and D100 are scheduled for official commercial use in 2027. However, all three chips have already appeared in a single device. AllWeather Tech observed on-site that Xiaomi showcased an AI Cube "Prototype," a desktop AI high-computing-power terminal prototype. This product integrates the Xuanjie O3, O100, and D100, locally deploys dual models of 120B and 3B parameters, and supports switching between fast and slow systems. **According to Xiaomi staff introducing the product to AllWeather Tech, this device operates offline without internet connectivity, runs on the Xiaomi HyperOS system, and it is currently undetermined whether it will be sold externally, likely depending on market demand.** In this light, the AI Cube serves more as a concentrated showcase of Xiaomi's three self-developed chips. Their true commercial value will still be determined by the scale of their implementation across different devices such as smartphones, AI computing units, and automobiles. In terms of design, the O3 adopts a 3nm process, integrates 24 billion transistors, features a 10-core CPU, a 16-core GPU, and a 200 TOPS NPU, and supports LPDDR6 memory for the first time; The O100 utilizes a 6nm process and 3D wafer-level stacking, directly connecting two layers of DRAM and one layer of NPU computing wafers via Hybrid Bonding. Its near-memory computing bandwidth reaches 1.22 TB/s, and it is equipped with a 14-core NPU; The D100 adopts a 3nm process, features a 20-core CPU and a 16-core NPU, supports up to 160GB of memory per chip, and can locally deploy large models with over 200 billion parameters. Behind this lies a calculation of economies of scale. Early-stage chip R&D requires massive investment. If the chips ultimately serve only one or two models, the R&D costs must be borne by limited shipment volumes. However, if the same computing capabilities can gradually enter smartphones, automobiles, and other local AI devices, the scale of terminals bearing this R&D investment will expand significantly. Of course, this logic currently remains at the first step of outward expansion. The O3 will enter mass-produced devices this year, while the O100 and D100 are scheduled for official commercial use in 2027. Whether these three chips can truly penetrate a sufficient number of devices, and whether self-developed chips can ultimately translate into cost advantages, performance improvements, or product differentiation, still requires validation through larger shipment scales. ### Related Stocks - [XIACY.US](https://longbridge.com/en/quote/XIACY.US.md) - [01810.HK](https://longbridge.com/en/quote/01810.HK.md) - [81810.HK](https://longbridge.com/en/quote/81810.HK.md) - [HXXD.SG](https://longbridge.com/en/quote/HXXD.SG.md) ## Related News & Research - [TSLA Competitor? 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