---
title: "TCL Technology Plans 12-Layer Glass Substrate Sample in Second Half"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/297430893.md"
description: "TCL Technology plans to launch a 12-layer glass substrate sample in the second half of this year, falling short of the industry's 20-layer standard for high-performance chip packaging due to external technical constraints. If the sample meets expectations, the company intends to begin constructing a pilot line within the current year."
datetime: "2026-08-30T15:19:17.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/297430893.md)
  - [en](https://longbridge.com/en/news/297430893.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/297430893.md)
generator: "portal-rs"
---

# TCL Technology Plans 12-Layer Glass Substrate Sample in Second Half

According to Jin10, TCL Technology said during a recent institutional briefing that mainstream glass-based advanced packaging for high-computing-power, high-performance chip packaging requires 20 layers, while the company is currently relying on external resources to advance the technical route and prepare complete samples. Limited by external technical constraints, the sample it plans to launch in the second half of this year will have about 12 layers, which is still short of 20 layers. If the sample performance and technical route are basically confirmed and meet expectations, the company will start construction of a pilot line within this year.

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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**