---
title: "Trumpf, Zeiss Expand Taiwan Semiconductor Push"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/298559655.md"
description: "Trumpf and Zeiss are expanding their semiconductor operations in Taiwan, with Trumpf tripling EUV laser capacity and Zeiss opening a new innovation center. Concurrently, Carpenter Technology, Corning, and AGC are targeting the AI chip ecosystem with specialized materials. Additionally, ASML's high NA EUV systems have secured endorsements from Intel, TSMC, and Samsung, with production timelines set for 2028 to 2030."
datetime: "2026-09-10T08:03:32.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/298559655.md)
  - [en](https://longbridge.com/en/news/298559655.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/298559655.md)
generator: "portal-rs"
---

# Trumpf, Zeiss Expand Taiwan Semiconductor Push

According to Nikkei Asia, Trumpf is tripling its EUV laser source capacity over two years and expanding its Taiwan presence to capture opportunities in the artificial intelligence ecosystem. Zeiss is also widening its semiconductor footprint in Taiwan and plans to open its third innovation center focused on semiconductors. The article said Carpenter Technology is sending senior executives to engage with Taiwan's chip ecosystem as demand rises for high-end alloys used in semiconductor facilities, while Corning and AGC are betting on specialty glass for future AI chips. It also said ASML's high NA EUV system, a roughly $400 million machine, won endorsements from Intel, Taiwan Semiconductor Manufacturing Co. and Samsung Electronics, with Intel saying it has begun using the tool in production this year, Samsung planning adoption from 2028 for advanced DRAM and TSMC by 2030.

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---
> **Disclaimer: This article is for reference only and does not constitute any investment advice.**