--- title: "Kepler Aims to Launch Energy-Saving Replacement for HBM in 2027" type: "News" locale: "en" url: "https://longbridge.com/en/news/300969072.md" description: "Kepler Computing aims to launch energy-saving memory replacements for HBM and SRAM by 2027. Partnering with GlobalFoundries, the company utilizes proprietary 3D ferroelectric memory technology to bypass EUV lithography constraints, addressing AI chip bottlenecks in cost, power, and heat. Kepler claims its solution offers 5-10x higher bandwidth per watt than HBM and significantly greater capacity than SRAM, leveraging monolithic stacking to enhance density without advanced node shrinking." datetime: "2026-10-05T20:49:12.000Z" locales: - [zh-CN](https://longbridge.com/zh-CN/news/300969072.md) - [en](https://longbridge.com/en/news/300969072.md) - [zh-HK](https://longbridge.com/zh-HK/news/300969072.md) generator: "portal-rs" --- # Kepler Aims to Launch Energy-Saving Replacement for HBM in 2027 //php echo do\_shortcode('\[responsivevoice\_button voice="US English Male" buttontext="Listen to Post"\]') ?> Kepler Computing, founded in 2018, aims to start production of memories that address HBM and SRAM “bottlenecks” in AI chips by next year, company executives told EE Times. The company is ready to work with industry partners to enter large-scale manufacturing, according to Intel Capital, an investor in Kepler. The company, which has partnered with GlobalFoundries for production, has built its own fab to ramp up its proprietary 3D and ferroelectric memory technology. The company believes a small Kepler fablet beside a customer’s legacy fab can help leapfrog to leading nodes by multiple generations at one tenth of the investment compared to a new advanced node. Kepler said it expects to make AI chips with partners such as GlobalFoundries without depending on EUV to reach advanced nodes. “We look just like Micron, or SK Hynix, or Samsung,” Kepler CEO Debo Olaosebikan told EE Times. “Customers just buy a memory module from us, and then they integrate it with their chip.” AI models are straining conventional memory architectures. Those stresses appear in rising DRAM and HBM design and manufacturing costs, higher energy use and heat dissipation, and diminishing scalability options. AI data centers are also stressing power grids. Most of the energy consumed in an AI facility is spent in data fetches between GPUs and HBM. ### **Monolithic stacking** Olaosebikan said the company has achieved monolithic stacking of devices within a chip that avoids thermal problems. “That’s why we can avoid EUV,” he said. “I can take the old big transistor but just use fewer of them and put things on top of that transistor.” The transistor on the bottom could be made with EUV. “We’re okay with that,” Olaosebikan said. “Whatever the base node is, we’re not pushing the requirement that you must shrink that transistor. We are going to amortize the use of that transistor with new devices that we stack on.” “We increase the memory density by a factor of two to three, and it is actually compatible into CMOS,” Kepler CTO Sasi Manipatruni told EE Times. The company has reached a stage where it is ready to work with industry partners, Intel Capital managing director Srini Ananth told EE Times. ### **Manufacturing ready** “They already have partners with some of the top leaders in the industry, in the ecosystem, and the time is now for them to take this into larger scale manufacturability,” Ananth said. “It opens the door to a new scale of high-performance computing architectures; you’re not constrained any longer by two-dimensional scaling.” SRAM scaling ended years ago around 5 nm, hindering the move to advanced nodes. “If you can use a backend of line process to get densities that are much higher than what the boundary node supports, you are advancing Moore’s Law,” Ananth said. He called Kepler’s five co-founders a unique team with expertise across physics, material science, and chip architecture. Three of the five co-founders were formerly with Intel. “I was, I think, the first engineer they hired to go find the next transistor,” said Manipatruni, who worked at Intel on next-generation logic. “Kepler came organically out of that effort when we figured out what is the specific architectural problem and the materials problem that we needed to be addressing. Our architecture addresses the interconnect problem for memory and increases the memory capacity and bandwidth much beyond the HBM roadmap and is not really bound by HBM physics.” ### **Two memories** Kepler has developed two memories that blur the lines between HBM and SRAM, Olaosebikan said. “For practical purposes, we can think of one of the memories as an HBM replacement, and the other one can be thought of as an SRAM replacement,” he added. “Our memories are always going to be much larger capacity than you can get with SRAM, at least 10×. There will be 5× to 10× more bandwidth per watt than HBM.” The company declined to go into detail on its ferroelectric memory. “We think that if our foreign adversaries know what the material is and know that it allows them to circumvent EUV, they would be all over it,” Manipatruni said. “So, we are being very careful with the materials specifications. Over the past seven years or so, we went through thousands of iterations of discovering the ferroelectric; the composition, the gradients, the electrodes, the whole shebang it takes to discover that class of materials.” Kepler’s HBM replacement will rely on 3D packaging technology the company has developed. “When people do 3D integration, they are worried about thermals,” Kepler co-founder Rajeev Dokania said. “Our 3D architecture works around that. There’s negligible thermal overhead relative to the traditional way of doing it. That brings in a tremendous amount of bandwidth at a very low energy cost.” The company said all its production capacity for 2027 is allocated. Kepler declined to name customers and partners outside of GlobalFoundries, saying only that they are in AI data centers as well as manufacturing. Over the longer term, Kepler also plans to develop logic chips. * * * ##### Also read: Dynamic AI Demands Drive Memory Diversity AI Triggers a New Memory Super Cycle The Great Memory Stockpile AI AND BIG DATA, HBM, MEMORY, SRAM INTEL CAPITAL, KEPLER COMPUTING ### Related Stocks - [GFS.US](https://longbridge.com/en/quote/GFS.US.md) - [GFSG.US](https://longbridge.com/en/quote/GFSG.US.md) - [INTC.US](https://longbridge.com/en/quote/INTC.US.md) - [MU.US](https://longbridge.com/en/quote/MU.US.md) - [SKHY.US](https://longbridge.com/en/quote/SKHY.US.md) - [SSNGY.US](https://longbridge.com/en/quote/SSNGY.US.md) ## Related News & Research - [Learn Why The Bull Case For GlobalFoundries Stock Could Change Following U.S. AI Chip Packaging Deal](https://longbridge.com/en/news/301390073.md) - [Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI](https://longbridge.com/en/news/301412587.md) - [GlobalFoundries plans 2028 start of FDX Fusion chip manufacturing at Dresden plant](https://longbridge.com/en/news/301396916.md) - [GlobalFoundries marks Dresden expansion milestone, announces next-generation platform for Physical AI](https://longbridge.com/en/news/301403253.md) - [Xanadu Quantum Technologies partners with GlobalFoundries to scale photonic quantum chip manufacturing](https://longbridge.com/en/news/301025724.md) --- > **Disclaimer: This article is for reference only and does not constitute any investment advice.**