---
title: "Baidu AI Chip Unit Kunlunxin's Hong Kong IPO Is Said To Slip To Next Year - Bloomberg News"
type: "News"
locale: "en"
url: "https://longbridge.com/en/news/304080434.md"
datetime: "2026-11-03T08:38:02.000Z"
locales:
  - [zh-CN](https://longbridge.com/zh-CN/news/304080434.md)
  - [en](https://longbridge.com/en/news/304080434.md)
  - [zh-HK](https://longbridge.com/zh-HK/news/304080434.md)
generator: "portal-rs"
---

# Baidu AI Chip Unit Kunlunxin's Hong Kong IPO Is Said To Slip To Next Year - Bloomberg News

Nov 3 (Reuters) - \* BAIDU AI CHIP UNIT KUNLUNXIN'S HONG KONG IPO IS SAID TO SLIP TO NEXT YEAR - BLOOMBERG NEWS Source text: https://tinyurl.com/4wza596m Further company coverage: (9888.HK)

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> **Disclaimer: This article is for reference only and does not constitute any investment advice.**