According to Jin10, TCL Technology said during a recent institutional briefing that mainstream glass-based advanced packaging for high-computing-power, high-performance chip packaging requires 20 layers, while the company is currently relying on external resources to advance the technical route and prepare complete samples. Limited by external technical constraints, the sample it plans to launch in the second half of this year will have about 12 layers, which is still short of 20 layers. If the sample performance and technical route are basically confirmed and meet expectations, the company will start construction of a pilot line within this year.