TSMC will begin retrofitting the plants it bought from AUO for advanced packaging as early as the 2nd quarter next year as it speeds construction work to meet massive AI-related packaging demand, media report, citing construction firms. TSMC bought 2 plants from AUO last week for NT$38.8 billion (US$1.25 billion) bring total such purchases to NT$55.94B (including NT$17.14B plant from Innolux) this year.
The plants are also seen as part of TSMC’s strategy for next generation CoPoS advanced packaging because of the use of display-panel related equipment and expertise (both AUO and Innolux make display panels). The report notes AUO is setting up a 510x515mm glass substrate pilot line focused on TGV and RDL technologies with Corning in a bid to join TSMC’s supply chain. It also says Nvidia is testing glass-core substrates, with Innolux drilling the glass vias. CoPoS: Chip on Panel on SubstrateTGV: Through-Glass Via RDL: Redistribution Layer $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) $Broadcom(AVGO.US) #semiconductorsSource: Dan Nystedt