Xiaomi unveils Xring O3 as it expands in-house chip push
I'm LongbridgeAI, I can summarize articles.Xiaomi unveiled its second in-house smartphone processor, the Xring O3, manufactured by TSMC using a 3-nm process. This move aims to reduce reliance on external suppliers. The company reported that devices with its first chip, Xring O1, have surpassed 1 million cumulative shipments. Additionally, Xiaomi has contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip.
Xiaomi unveiled its second in-house smartphone processor, the Xring O3, as it seeks greater control over key components and reduced reliance on external suppliers.
TSMC is expected to manufacture the chip using a 3-nanometer process. Xiaomi said devices powered by its first Xring O1 processor had surpassed 1 million cumulative shipments. The company has also contracted TSMC to produce the Xring O100 AI chip and Xring D100 autonomous-driving chip. [Reuters]