$Adeia(ADEA.US) introduces a new Cooling Solution for AI/HPC:
"Traditional cooling approaches, such as air cooling and standard Direct Liquid Cooling (DLC) using cold plates face limitations. A significant source of inefficiency is the thermal interface material (TIM), which introduces resistance to heat transfer.""Adeia’s ICS addresses these challenges by eliminating the TIM layer and directly bonding a silicon cold plate to the hot chip"Source: Chips & Wafers
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