---
title: "HANMI Semiconductor and TES partner to develop Hybrid Bonder for next-gen #HBM$BESISource: Chips &am"
description: "HANMI Semiconductor and TES partner to develop Hybrid Bonder for next-gen #HBM$BESISource: Chips & Wafers"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000159920.md"
published_at: "2025-07-24T13:47:30.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# HANMI Semiconductor and TES partner to develop Hybrid Bonder for next-gen #HBM$BESISource: Chips &am

HANMI Semiconductor and TES partner to develop Hybrid Bonder for next-gen #HBM

$BESI

Source: Chips & Wafers

---

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