---
title: "TSMC will break ground on its 1st USA advanced semiconductor packaging plant next year, aimed at SoI"
description: "TSMC will break ground on its 1st USA advanced semiconductor packaging plant next year, aimed at SoIC and CoW (oS) production, with oS work to be done by partner Amkor, media report. SoIC: System on I"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000164464.md"
published_at: "2025-07-28T00:27:21.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# TSMC will break ground on its 1st USA advanced semiconductor packaging plant next year, aimed at SoI

TSMC will break ground on its 1st USA advanced semiconductor packaging plant next year, aimed at SoIC and CoW (oS) production, with oS work to be done by partner Amkor, media report.

SoIC: System on Integrated Chip

CoWoS: Chip-on-Wafer-on-Substrate. $Taiwan Semiconductor(TSM.US) $Amkor Tech(AMKR.US) #semiconductors

Source: Dan Nystedt

### Related Stocks

- [TSM.US - Taiwan Semiconductor](https://longbridge.com/en/quote/TSM.US.md)
- [AMKR.US - Amkor Tech](https://longbridge.com/en/quote/AMKR.US.md)

---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.