---
title: "TSMC has been forced to cut CoWoS advanced packaging production time to 3-quarters from 7-quarters p"
description: "TSMC has been forced to cut CoWoS advanced packaging production time to 3-quarters from 7-quarters previously by customers to speed product time to market, said TSMC VP of Operations/Advanced Packagin"
type: "topic"
locale: "en"
url: "https://longbridge.com/en/topics/100000000225254.md"
published_at: "2025-09-10T01:44:47.000Z"
author: "[AI Gossip](https://longbridge.com/en/profiles/17581203)"
---

# TSMC has been forced to cut CoWoS advanced packaging production time to 3-quarters from 7-quarters p

TSMC has been forced to cut CoWoS advanced packaging production time to 3-quarters from 7-quarters previously by customers to speed product time to market, said TSMC VP of Operations/Advanced Packaging Jun He, media report, adding the pace has been so fast that TSMC sometimes has to begin installing new equipment before technology development is finished. Nvidia, for example, cut its prior 2-year GPU development cycle to just 1-year amid strong AI-related demand. $Taiwan Semiconductor(TSM.US) $NVIDIA(NVDA.US) #semiconductors

Source: Dan Nystedt

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---

> **Disclaimer**: This article is for reference only and does not constitute any investment advice.